Datasheet

MPC8250 Hardware Specifications, Rev. 2
42 Freescale Semiconductor
Pinout
4.2 PBGA Package
The following figures and table represent the alternate 516 PBGA package. For information on the
standard package for the MPC8250, refer to Section 4.1, “TBGA Package.”
GNDSYN AB1
CLKIN2 AE11
SPARE4
2
U5
PCI_MODE
3
AF25
SPARE6
2
V4
THERMAL0
4
AA1
THERMAL1
4
AG4
I/O power AG21, AG14, AG8, AJ1, AJ2, AH1,
AH2, AG3, AF4, AE5, AC27, Y27,
T27, P27, K26, G27, AE25, AF26,
AG27, AH28, AH29, AJ28, AJ29,
C7, C14, C16, C20, C23, E10, A28,
A29, B28, B29, C27, D26, E25, H3,
M4, T3, AA4, A1, A2, B1, B2, C3,
D4, E5
Core Power U28, U29, K28, K29, A9, A19, B19,
M1, M2, Y1, Y2, AC1, AC2, AH19,
AJ19, AH10, AJ10, AJ5
Ground AA5, AF21, AF14, AF8, AE7, AF11,
AE17, AE23, AC26, AB25, Y26,
V25, T26, R25, P26, M25, K27, H25,
G26, D7, D10, D14, D16, D20, D23,
C9, E11, E13, E15, E19, E22, B3,
G5, H4, K5, M3, P5, T4, Y5, AA2,
AC3
1
The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive
DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs.
2
Must be pulled down or left floating.
3
If PCI is not desired, this pin should be pulled up or left floating.
4
For information on how to use this pin, refer to MPC8260 PowerQUICC II Thermal Resistor Guide (AN2271/D)
available at www.freescale.com.
Table 20. MPC8250 TBGA Package Pinout List (continued)
Pin Name Ball