Datasheet

MPC8250 Hardware Specifications, Rev. 2
Freescale Semiconductor 31
Pinout
Figure 14 shows the side profile of the TBGA package to indicate the direction of the top surface view.
Figure 14. Side View of the TBGA Package
Table 20 shows the pinout list of the TBGA package of the MPC8250. Table 19 defines the conventions
and acronyms used in Table 20.
Table 19. Symbol Legend
Symbol Meaning
OVERBAR Signals with overbars, such as TA
, are active low.
MII Indicates that a signal is part of the media independent interface.
Table 20. MPC8250 TBGA Package Pinout List
Pin Name Ball
BR W5
BG F4
ABB/IRQ2 E2
TS E3
A0 G1
A1 H5
A2 H2
A3 H1
A4 J5
A5 J4
A6 J3
A7 J2
A8 J1
A9 K4
A10 K3
A11 K2
A12 K1
Soldermask
Copper Traces
Die
Copper Heat Spreader
(Oxidized for Insulation)
1.27 mm Pitch
Glob-Top Dam
Wire Bonds
Etched
Pressure Sensitive
Die
Glob-Top Filled Area
Polymide Tape
Cavity
Adhesive
Attach
View