Datasheet

MPC8250 Hardware Specifications, Rev. 2
Freescale Semiconductor 3
Features
Supports bus snooping for data cache coherency
Floating-point unit (FPU)
Separate power supply for internal logic (1.8 V) and for I/O (3.3V)
Separate PLLs for G2 core and for the CPM
G2 core and CPM can run at different frequencies for power/performance optimization
Internal core/bus clock multiplier that provides 1.5:1, 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 5:1, 6:1 ratios
Internal CPM/bus clock multiplier that provides 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 5:1, 6:1 ratios
64-bit data and 32-bit address 60x bus
Bus supports multiple master designs
Supports single- and four-beat burst transfers
64-, 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller
Supports data parity or ECC and address parity
32-bit data and 18-bit address local bus
Single-master bus, supports external slaves
Eight-beat burst transfers
32-, 16-, and 8-bit port sizes controlled by on-chip memory controller
60x-to-PCI bridge
Programmable host bridge and agent
32-bit data bus, 66 MHz, 3.3 V
Synchronous and asynchronous 60x and PCI clock modes
All internal address space available to external PCI host
DMA for memory block transfers
PCI-to-60x address remapping
System interface unit (SIU)
Clock synthesizer
Reset controller
Real-time clock (RTC) register
Periodic interrupt timer
Hardware bus monitor and software watchdog timer
IEEE 1149.1™ JTAG test access port
Twelve-bank memory controller
Glueless interface to SRAM, page mode SDRAM, DRAM, EPROM, Flash and other user-
definable peripherals
Byte write enables and selectable parity generation
32-bit address decodes with programmable bank size
Three user programmable machines, general-purpose chip-select machine, and page-mode
pipeline SDRAM machine
Byte selects for 64 bus width (60x) and byte selects for 32 bus width (local)