Datasheet

MPC5200B Data Sheet, Rev. 4
58 Freescale Semiconductor
2.2 Mechanical Dimensions
Figure 50 provides the mechanical dimensions, top surface, side profile, and pinout for the MPC5200B, 272 TE-PBGA
package.
Figure 50. Mechanical Dimensions and Pinout Assignments for the MPC5200B, 272 TE-PBGA
CASE 1135A–01
ISSUE B
DATE 10/15/1997
CB
DIM MIN MAX
MILLIMETERS
A 2.05 2.65
A1 0.50 0.70
A2 0.50 0.70
A3 1.05 1.25
b 0.60 0.90
D 27.00 BSC
D1 24.13 REF
D2 23.30 24.70
E 27.00 BSC
E1 24.13 REF
E2 23.30 24.70
e 1.27 BSC
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. DIMENSION IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER PARALLEL TO
PRIMARY DATUM A.
4. PRIMARY DATUM A AND THE SEATING PLANE
ARE DEFINED BY THE SPHERICAL CROWNS OF
THE SOLDER BALLS.
PIN A1
E2
D2
D
E
B
M
0.2
INDEX
C
0.2
4X
TOP VIEW
(D1)
A
(E1)
4X e
19X e
/2
19X e
123 54 678910111213141516171819
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
20
V
W
Y
272X b
3
CB
M
0.3
A
M
0.15
A
SIDE VIEW
0.35
A
A
0.2
A
272X
A
BOTTOM VIEW
A2
A1
A3