Datasheet

Electrical Characteristics
MCF5208 ColdFire
®
Microprocessor Data Sheet, Rev. 3
Freescale Semiconductor 19
The average chip-junction temperature (T
J
) in °C can be obtained from:
Eqn. 1
Where:
T
A
= Ambient Temperature, °C
Q
JMA
= Package Thermal Resistance, Junction-to-Ambient, ×C/W
P
D
=P
INT
+ P
I/O
P
INT
=I
DD
× IV
DD
, Watts - Chip Internal Power
P
I/O
= Power Dissipation on Input and Output Pins — User Determined
For most applications P
I/O
< P
INT
and can be ignored. An approximate relationship between P
D
and T
J
(if
P
I/O
is neglected) is:
Eqn. 2
Solving equations 1 and 2 for K gives:
Eqn. 3
where K is a constant pertaining to the particular part. K can be determined from Equation 3 by measuring
P
D
(at equilibrium) for a known T
A
. Using this value of K, the values of P
D
and T
J
can be obtained by
solving Equation 1 and Equation 2 iteratively for any value of T
A
.
5.3 ESD Protection
3
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
4
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
5
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written in conformance
with Psi-JT.
6
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written in conformance
with Psi-JT.
7
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written in conformance
with Psi-JT.
Table 6. ESD Protection Characteristics
1, 2
NOTES:
1
All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for
Automotive Grade Integrated Circuits.
Characteristics Symbol Value Unit
ESD Target for Human Body Model HBM 2000 V
T
J
T
A
P
D
Θ
JMA
×()+=
P
D
K
T
J
273°C+()
---------------------------------
=
KP
D
T
A
273°C×()Q
JMA
P
D
2
×+×=