Datasheet
MCF5208 ColdFire
®
Microprocessor Data Sheet, Rev. 3
Electrical Characteristics
Freescale Semiconductor18
5.2 Thermal Characteristics
Table 5 lists thermal resistance values
Operating Temperature Range (Packaged) T
A
(T
L
- T
H
)
– 40 to 85 °C
Storage Temperature Range T
stg
– 55 to 150 °C
NOTES:
1
Functional operating conditions are given in Section 5.4, “DC Electrical Specifications”.
Absolute maximum ratings are stress ratings only, and functional operation at the maxima is
not guaranteed. Continued operation at these levels may affect device reliability or cause
permanent damage to the device.
2
This device contains circuitry protecting against damage due to high static voltage or
electrical fields; however, it is advised that normal precautions be taken to avoid application of
any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of
operation is enhanced if unused inputs are tied to an appropriate logic voltage level (V
SS
or
EV
DD
).
3
Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive and negative clamp voltages,
then use the larger of the two values.
4
All functional non-supply pins are internally clamped to V
SS
and EV
DD
.
5
Power supply must maintain regulation within operating EV
DD
range during instantaneous
and operating maximum current conditions. If positive injection current (V
in
> EV
DD
) is greater
than I
DD
, the injection current may flow out of EV
DD
and could result in external power supply
going out of regulation. Ensure external EV
DD
load shunts current greater than maximum
injection current. This is the greatest risk when the MCU is not consuming power (ex; no
clock). Power supply must maintain regulation within operating EV
DD
range during
instantaneous and operating maximum current conditions.
Table 5. Thermal Characteristics
Characteristic Symbol 196MBGA 144MBGA 160QFP 144LQFP Unit
Junction to ambient, natural convection Four layer board
(2s2p)
θ
JMA
47
1,2
NOTES:
1
θ
JMA
and Ψ
jt
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of θ
JmA
and power dissipation specifications in the system design to prevent device junction temperatures
from exceeding the rated specification. System designers should be aware that device junction temperatures can be significantly
influenced by board layout and surrounding devices. Conformance to the device junction temperature specification can be
verified by physical measurement in the customer’s system using the Ψ
jt
parameter, the device power dissipation, and the
method described in EIA/JESD Standard 51-2.
2
Per JEDEC JESD51-6 with the board horizontal.
47
1,2
49
1,2
65
1,2
°C / W
Junction to ambient (@200 ft/min) Four layer board
(2s2p)
θ
JMA
43
1,2
43
1,2
44
1,2
58
1,2
°C / W
Junction to board θ
JB
36
3
36
3
40
3
50
3
°C / W
Junction to case θ
JC
22
4
22
4
39
4
19
4
°C / W
Junction to top of package Ψ
jt
6
1,5
6
1,5
12
1,6
5
1,7
°C / W
Maximum operating junction temperature T
j
105 105 105 105
o
C
Table 4. Absolute Maximum Ratings
1,
2
(continued)