Datasheet

Appendix A Electrical Characteristics
Freescale Semiconductor MC9S12C-Family / MC9S12GC-Family 653
Rev 01.24
Table A-5. Thermal Package Characteristics
(1)
1. The values for thermal resistance are achieved by package simulations
Num C Rating Symbol Min Typ Max Unit
1 T Thermal Resistance LQFP48, single layer PCB
(2)
2. PC Board according to EIA/JEDEC Standard 51-2
θ
JA
——69
o
C/W
2T
Thermal Resistance LQFP48, double sided PCB
with 2 internal planes
(3)
3. PC Board according to EIA/JEDEC Standard 51-7
θ
JA
——53
o
C/W
3 T Junction to Board LQFP48 θ
JB
——30
o
C/W
4 T Junction to Case LQFP48 θ
JC
——20
o
C/W
5 T Junction to Package Top LQFP48 Ψ
JT
—— 4
o
C/W
6 T Thermal Resistance LQFP52, single sided PCB θ
JA
——65
o
C/W
7T
Thermal Resistance LQFP52, double sided PCB
with 2 internal planes
θ
JA
——49
o
C/W
8 T Junction to Board LQFP52 θ
JB
——31
o
C/W
9 T Junction to Case LQFP52 θ
JC
——17
o
C/W
10 T Junction to Package Top LQFP52 Ψ
JT
—— 3
o
C/W
11 T Thermal Resistance QFP 80, single sided PCB θ
JA
——52
o
C/W
12 T
Thermal Resistance QFP 80, double sided PCB
with 2 internal planes
θ
JA
——42
o
C/W
13 T Junction to Board QFP80 θ
JB
——28
o
C/W
14 T Junction to Case QFP80 θ
JC
——18
o
C/W
15 T Junction to Package Top QFP80 Ψ
JT
—— 4
o
C/W