Datasheet

Table Of Contents
MC9S12DP256 — Revision 1.1
System Configuration
System Configuration
System Configuration
Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Modules Variabilities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
MCU Variabilities. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Introduction
This section describes the variabilities of the modules that are present at
the MCU level and how they are connected.
NOTE:
Needs some completion or to be removed at all.
Modules Variabilities
MMC
The information is also readable by the MCU at address $1C, $1D
(MEMSIZ0 and MEMSIZ1)
Table 10 MMC Module Variable I/O Signals
Signal Name I/O Configuration Description Connected to
reg_sw0 I Register Block Size set to 1K 0
ram_sw2:0 I RAM Memory Size set to 12K 101
eep_sw1:0 I EEPROM Size set to 4K 10
rom_sw1:0 I ROM Mapping Select set to 48k 10
pag_sw1:0 I 256K on-chip/768K off-chip 01
Freescale Semiconductor, I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
nc...