Datasheet

MC9S08SH32 Series Data Sheet, Rev. 2
Freescale Semiconductor 315
Appendix B
Ordering Information and Mechanical Drawings
B.1 Ordering Information
This section contains ordering information for MC9S08SH32 and MC9S08SH16 devices.
Jennifer
B.1.1 Device Numbering Scheme
This device uses a smart numbering system. Refer to the following diagram to understand what each
element of the device number represents.
Figure B-1. MC9S08SH32 Device Numbering Scheme
Table B-1. Device Numbering System
Device Number
1
1
See Table 1-1for a complete description of modules included on each device.
Memory Available Packages
2
2
See Table B-2 for package information.
Flash RAM 28-Pin 20-Pin 16-Pin
MC9S08SH32 32 K 1024 B
28 TSSOP
28 SOIC
20 TSSOP 16 TSSOP
MC9S08SH16 16 1024 B
MC 9 S08 SH n C xx R
Status
- MC = Fully Qualified
Main Memory Type
- 9 = Flash-based
Core
Family
- SH
Memory Size
- 32 Kbytes
- 16 Kbytes
Temperature Option
- C = –40 to 85 °C
- M = –40 to 125 °C
Package Designator
Two letter descriptor (refer to
Table B-2).
Tape and Reel Suffix (optiona
- R = Tape and Reel
PRELIMINARY