Datasheet

Package Information
MC9S08QE8 Series Data Sheet, Rev. 8
Freescale Semiconductor 31
5 Package Information
5.1 Mechanical Drawings
The following pages are mechanical drawings for the packages described in Table 21.
Table 21. Package Descriptions
Pin Count Package Type Abbreviation Designator Case No. Document No.
32 Quad Flat No-Leads QFN FM 2078 98ASA00071D
32 Low Quad Flat Package LQFP LC 873A 98ASH70029A
28 Small Outline Integrated Circuit SOIC WL 751F 98ASB42345B
20 Small Outline Integrated Circuit SOIC WJ 751D 98ASB42343B
16 Plastic Dual In-line Package PDIP PG 648 98ASB42431B
16 Thin Shrink Small Outline Package TSSOP TG 948F 98ASH70247A
MC
Temperature range
Family
Memory
Status
Core
(C = –40 C to 85 C)
(9 = Flash-based)
9
S08
XX
(MC = Fully qualified)
Package designator (see Ta ble 2 1)
Approximate flash size in Kbytes
QE
8C