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Freescale Semiconductor

Data Sheet: Technical Data

An Energy Efficient Solution by Freescale

Document Number: MC9S08QE32

Rev. 7, 9/2011

This document contains information on a product under development. Freescale reserves the

right to change or discontinue this product without notice.

MC9S08QE32

MC9S08QE32 Series

Covers: MC9S08QE32 and

MC9S08QE16

48-QFN

Case 1314

7 mm 7 mm

32-LQFP

Case 873A

7 mm 7 mm

44-LQFP

Case 824D

10 mm 10 mm

28-SOIC

Case 751F

32-QFN

Case 1582

5 mm 5 mm

Features

• 8-Bit HCS08 Central Processor Unit (CPU)

– Up to 50.33 MHz HCS08 CPU at 3.6 V to 2.4 V, 40 MHz CPU at 2.4

V to 2.1 V and 20 MHz CPU at 2.1 V to 1.8 V across temperature

range of –40 °C to 85 °C

– HC08 instruction set with added BGND instruction

– Support for up to 32 interrupt/reset sources

•On-Chip Memory

– Flash read/program/erase over full operating voltage and

temperature

– Random-access memory (RAM)

– Security circuitry to prevent unauthorized access to RAM and flash

contents

• Power-Saving Modes

– Two very low power stop modes

– Reduced power wait mode

– Peripheral clock enable register can disable clocks to unused

modules, thereby reducing currents; allows clocks to remain enabled

to specific peripherals in stop3 mode.

– Very low power external oscillator that can be used in run, wait, and

stop modes to provide accurate clock source to real time counter.

–6 s typical wakeup time from stop3 mode

• Clock Source Options

– Oscillator (XOSCVLP) — Loop-control Pierce oscillator; crystal or

ceramic resonator range of 31.25 kHz to 38.4 kHz or 1 MHz to 16

MHz

– Internal clock source (ICS) — Internal clock source module

containing a frequency-locked-loop (FLL) controlled by internal or

external reference; precision trimming of internal reference allows

0.2% resolution and 2% deviation over temperature and voltage;

supports CPU frequencies from

4 kHz to 50.33 MHz.

• System Protection

– Watchdog computer operating properly (COP) reset with option to

run from dedicated 1 kHz internal clock source or bus clock.

– Low-voltage warning with interrupt.

– Low-voltage detection with reset or interrupt

– Selectable trip points.

– Illegal opcode detection with reset

– Illegal address detection with reset

– Flash block protection

• Development Support

– Single-wire background debug interface

– Breakpoint capability to allow single breakpoint setting during

in-circuit debugging (plus three breakpoints in on-chip debug

module)

– On-chip in-circuit emulator (ICE) debug module containing three

comparators and nine trigger modes. Eight deep FIFO for storing

change-of-flow addresses and event-only data. Debug module

supports both tag and force breakpoints

• Peripherals

– ADC — 10-channel, 12-bit resolution; 2.5s conversion time;

automatic compare function; 1.7 mV/C temperature sensor;

internal bandgap reference channel; operation in stop3; fully

functional from 3.6 V to 1.8 V

– ACMPx — Two analog comparators with selectable interrupt on

rising, falling, or either edge of comparator output; compare option

to fixed internal bandgap reference voltage; outputs can be

optionally routed to TPM module; operation in stop3

–

SCIx — Two serial communications interface modules with

optional 13-bit break. Full duplex non-return to zero (NRZ); LIN

master extended break generation; LIN slave extended break

detection; wake on active edge.

– SPI— One serial peripheral interface; full-duplex or single-wire

bidirectional; double-buffered transmit and receive; master or

slave mode; MSB-first or LSB-first shifting

– IIC — One IIC; up to 100 kbps with maximum bus loading;

multi-master operation; programmable slave address; interrupt

driven byte-by-byte data transfer; supports broadcast mode and

10-bit addressing

– TPMx — One 6-channel (TPM3) and two 3-channel (TPM1 and

TPM2); selectable input capture, output compare, or buffered

edge- or center-aligned PWM on each channel;

– RTC — (Real-time counter) 8-bit modulus counter with binary or

decimal based prescaler; external clock source for precise time

base, time-of-day, calendar or task scheduling functions; free

running on-chip low power oscillator (1 kHz) for cyclic wake-up

without external components; runs in all MCU modes

• Input/Output

– 40 GPIOs, including 1 output-only pin and 1 input-only pin

– 16 KBI interrupts with selectable polarity

– Hysteresis and configurable pull up device on all input pins;

Configurable slew rate and drive strength on all output pins.

• Package Options

– 48-pin QFN, 44-pin LQFP, 32-pin LQFP/QFN, 28-pin SOIC

Summary of content (32 pages)

PAGE 1
Freescale Semiconductor Data Sheet: Technical Data Document Number: MC9S08QE32 Rev. 7, 9/2011 An Energy Efficient Solution by Freescale MC9S08QE32 Series Covers: MC9S08QE32 and MC9S08QE16 Features • 8-Bit HCS08 Central Processor Unit (CPU) – Up to 50.33 MHz HCS08 CPU at 3.6 V to 2.4 V, 40 MHz CPU at 2.4 V to 2.1 V and 20 MHz CPU at 2.1 V to 1.
PAGE 2
Table of Contents 1 2 3 MCU Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . 9 3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.2 Parameter Classification . . . . . . . . . . . . . . . . . . . 9 3.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . 9 3.4 Thermal Characteristics. . . . . . . . . . . .
PAGE 3
MCU Block Diagram 1 MCU Block Diagram The block diagram, Figure 1, shows the structure of the MC9S08QE32 MCU. PORT A VSS VOLTAGE REGULATOR VREFL VREFH SERIAL COMMUNICATIONS INTERFACE MODULE(SCI1) RxD1 TxD1 3-CHANNEL TIMER/PWM MODULE (TPM1) (MC9S08QE16 = 1024 BYTES) LOW-POWER OSCILLATOR 31.25 kHz to 38.4 kHz 1 MHz to 16 MHz (XOSCVLP) SDA SERIAL PERIPHERAL INTERFACE MODULE(SPI) USER RAM (MC9S08QE32 = 2048 BYTES) 50.
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Pin Assignments 2 Pin Assignments PTA1/KBI1P1/TPM2CH0/AD 37 PTA1/KBI1P1/TPM2CH0/ADP1/ACMP1– 38 PTA0/KBI1P0/TPM1CH0/ADP0/ACMP1+ 39 PTC7/TxD2/ACMP2– 40 PTC6/RxD2/ACMP2+ 41 PTE3/SS 42 PTE2/MISO 43 PTE1/MOSI 44 PTE0/TPM2CLK/SPSCK 45 PTC5/TPM3CH5/ACMP2O 46 PTC4/TPM3CH4 47 PTA5/IRQ/TPM1CLK/RESET 48 PTA4/ACMP1O/BKGD/MS This section shows the pin assignments for the MC9S08QE32 series devices.
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PTA4/ACMP1O/BKGD/MS PTA5/IRQ/TPM1CLK/RESET PTC4/TPM3CH4 PTC5/TPM3CH5/ACMP2O PTE0/TPM2CLK PTE1 PTE2 PTC6/RxD2/ACMP2+ PTC7/TxD2/ACMP2– PTA0/KBI1P0/TPM1CH0/ADP0/ACMP PTA1/KBI1P1/TPM2CH0/ADP1/ACMP 44 43 42 41 40 39 38 37 36 35 34 Pin Assignments 7 27 VDD VSSAD 8 26 PTA6/TPM1CH2/ADP8 VSS 9 25 PTA7/TPM2CH2/ADP9 10 24 PTB0/KBI1P4/RxD1/ADP4 23 PTB1/KBI1P5/TxD1/ADP5 PTB7/SCL/EXTAL PTB6/SDA/XTAL 11 22 VREFL PTB2/KBI1P6/SPSCK/ADP6 VSS 21 28 PTB3/KBI1P7/MOSI/ADP7 6 20 VR
PAGE 6
PTC5/TPM3CH5/ACMP2O PTC6/RxD2/ACMP2+ PTC7/TxD2/ACMP2– PTA0/KBI1P0/TPM1CH0/ADP0/ACMP1+ PTA1/KBI1P1/TPM2CH0/ADP1/ACMP1– PTD0/KBI2P0 PTC4/TPM3CH4 1 PTA5/IRQ/TPM1CLK/RESET PTD1/KBI2P1 PTA4/ACMP1O/BKGD/MS Pin Assignments 32 31 30 29 28 27 26 25 4 21 VSSAD/VREFL 5 20 PTA6/TPM1CH2/ADP8 VSS 6 19 PTA7/TPM2CH2/ADP9 PTB7/SCL/EXTAL 7 18 PTB0/KBIP4/RxD1/ADP4 PTB6/SDA/XTAL 8 17 PTB1/KBIP5/TxD1/ADP5 9 10 11 12 13 14 15 16 PTB2/KBI1P6/SPSCK/ADP6 PTD2/KBI2P2 PTB3/KBI1P7/MOSI/AD
PAGE 7
Pin Assignments PTC5/TPM3CH5/ACMP2O 1 28 PTC6/RxD2/ACMP2+ PTC4/TPM3CH4 2 27 PTC7/TxD2/ACMP2– PTA5/IRQ/TPM1CLK/RESET 3 26 PTA0/KBI1P0/TPM1CH0/ADP0/ACMP1+ PTA4/ACMP1O/BKGD/MS 4 25 PTA1/KBI1P1/TPM2CH0/ADP1/ACMP1– VDD 5 24 PTA2/KBI1P2/SDA/ADP2 VDDAD/VREFH 6 23 PTA3/KBI1P3/SCL/ADP3 VSSAD/VREFL 7 22 PTA6/TPM1CH2/ADP8 VSS 8 21 PTA7/TPM2CH2/ADP9 PTB7/SCL/EXTAL 9 20 PTB0/KBI1P4/RxD1/ADP4 PTB6/SDA/XTAL 10 19 PTB1/KBI1P5/TxD1/ADP5 PTB5/TPM1CH1/SS 11 18 PTB2/KBI1P6/SPSCK/ADP6
PAGE 8
Pin Assignments Table 1.
PAGE 9
Electrical Characteristics 3 Electrical Characteristics 3.1 Introduction This section contains electrical and timing specifications for the MC9S08QE32 series of microcontrollers available at the time of publication. 3.2 Parameter Classification The electrical parameters shown in this supplement are guaranteed by various methods. To give the customer a better understanding the following classification is used and the parameters are tagged accordingly in the tables where appropriate: Table 2.
PAGE 10
Electrical Characteristics Table 3. Absolute Maximum Ratings Rating Symbol Value Unit Supply voltage VDD –0.3 to +3.8 V Maximum current into VDD IDD 120 mA Digital input voltage VIn –0.3 to VDD + 0.3 V Instantaneous maximum current Single pin limit (applies to all port pins)1, 2, 3 ID 25 mA Tstg –55 to 150 C Storage temperature range 1 Input must be current limited to the value specified.
PAGE 11
Electrical Characteristics Table 4.
PAGE 12
Electrical Characteristics 3.5 ESD Protection and Latch-Up Immunity Although damage from electrostatic discharge (ESD) is much less common on these devices than on early CMOS circuits, normal handling precautions must be used to avoid exposure to static discharge. Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels of static without suffering any permanent damage.
PAGE 13
Electrical Characteristics Table 7. DC Characteristics Num C Characteristic Symbol Min Typical1 Max Unit 2.0 1.8 — 3.6 V VDD – 0.5 — — 2.7 V, ILoad = –10 mA VDD – 0.5 2.3 V, ILoad = –6 mA VDD – 0.5 — — — — VDD – 0.5 — — — — 100 1.8 V, ILoad = 2 mA — — 0.5 2.7 V, ILoad = 10 mA — — 0.5 2.3 V, ILoad = 6 mA — — 0.5 1.8 V, ILoad = 3 mA — — 0.5 — — 100 VDD  2.3 V 0.70 x VDD — — VDD 1.8 V 0.85 x VDD — — VDD  2.7 V — — 0.35 x VDD VDD 1.8 V — — 0.
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Electrical Characteristics Table 7. DC Characteristics (continued) Num C 2 3 4 5 6 7 Symbol Condition tPOR Min Typical1 Max Unit 10 — — s 16 D POR re-arm time 17 P Low-voltage detection threshold — high range VLVDH VDD falling VDD rising 2.11 2.16 2.16 2.21 2.22 2.27 V 18 P Low-voltage detection threshold — low range VLVDL VDD falling VDD rising 1.80 1.88 1.82 1.90 1.91 1.99 V 19 P Low-voltage warning threshold — high range VLVWH VDD falling VDD rising 2.36 2.36 2.
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Electrical Characteristics TYPICAL VOL VS IOL AT VDD = 3.0 V 1.2 85C 25C –40C 1 0.15 VOL (V) 0.8 VOL (V) TYPICAL VOL VS VDD 0.2 0.6 0.4 0.2 0.1 85C, IOL = 2 mA 25C, IOL = 2 mA –40C, IOL = 2 mA 0.05 0 0 0 5 10 IOL (mA) 15 1 20 2 3 VDD (V) 4 Figure 7. Typical Low-Side Driver (Sink) Characteristics — Low Drive (PTxDSn = 0) TYPICAL VOL VS VDD TYPICAL VOL VS IOL AT VDD = 3.0 V 1 0.4 85C 25C –40C 0.8 85C 25C –40C 0.3 VOL (V) VOL (V) 0.6 0.4 0.2 0.
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Electrical Characteristics TYPICAL VDD – VOH VS VDD AT SPEC IOH 0.4 TYPICAL VDD – VOH VS IOH AT VDD = 3.0 V 0.3 85C 25C –40C 0.6 VDD – VOH (V) VDD – VOH (V) 0.8 0.4 0.2 0 0 –5 –10 –15 –20 IOH (mA) 85C 25C –40C –25 0.2 IOH = –10 mA IOH = –6 mA 0.1 –30 IOH = –3 mA 0 1 2 3 4 VDD (V) Figure 10. Typical High-Side (Source) Characteristics — High Drive (PTxDSn = 1) 3.
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Electrical Characteristics Table 8. Supply Current Characteristics (continued) Num Parameter C Symbol 0.35 0.65 –40 to 25C 0.8 1.0 70 — 2.0 4.5 — 0.25 0.50 –40 to 25 0.65 0.85 70 C — Stop2 mode supply current S2IDD C Temp (C) Max — P VDD (V) Typical1 P 6 3 A 85 — C — 1.5 3.5 85 P — 0.45 1.00 –40 to 25 C — 1.5 2.3 70 — 4 8 — 0.35 0.
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Electrical Characteristics 1 Not available in stop2 mode. 3.8 External Oscillator (XOSCVLP) Characteristics Reference Figure 11 and Figure 12 for crystal or resonator circuits. Table 10. XOSC and ICS Specifications (Temperature Range = –40 to 85C Ambient) Num 1 2 Symbol Min Typical1 Max Unit Oscillator crystal or resonator (EREFS = 1, ERCLKEN = 1) Low range (RANGE = 0) C High range (RANGE = 1), high gain (HGO = 1) High range (RANGE = 1), low power (HGO = 0) flo fhi fhi 32 1 1 — — — 38.
PAGE 19
Electrical Characteristics XOSCVLP EXTAL XTAL RF RS Crystal or Resonator C1 C2 Figure 11. Typical Crystal or Resonator Circuit: High Range and Low Range/High Gain XOSCVLP EXTAL XTAL Crystal or Resonator Figure 12. Typical Crystal or Resonator Circuit: Low Range/Low Power 3.9 Internal Clock Source (ICS) Characteristics Table 11. ICS Frequency Specifications (Temperature Range = –40 to 85C Ambient) Symbol Min Typical1 Max Unit fint_t — 32.768 — kHz fint_ut 31.25 — 39.
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Electrical Characteristics Table 11. ICS Frequency Specifications (Temperature Range = –40 to 85C Ambient) (continued) Num C Characteristic Symbol Min Typical1 Max Unit 8 C Total deviation of trimmed DCO output frequency over voltage and temperature fdco_t — 0.5 –1.0 2 %fdco 9 C Total deviation of trimmed DCO output frequency over fixed voltage and temperature range of 0 C to 70 C fdco_t — 0.5 1 %fdco 10 C FLL acquisition time3 tAcquire — — 1 ms 11 C CJitter — 0.
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Electrical Characteristics Table 12. Control Timing (continued) Num C 8 D Min Typical1 Max Unit 100 1.
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Electrical Characteristics Table 13. TPM Input Timing No. C 1 D 2 Function Symbol Min Max Unit External clock frequency fTCLK 0 fBus/4 Hz D External clock period tTCLK 4 — tcyc 3 D External clock high time tclkh 1.5 — tcyc 4 D External clock low time tclkl 1.5 — tcyc 5 D Input capture pulse width tICPW 1.5 — tcyc tTCLK tclkh TCLK tclkl Figure 15. Timer External Clock tICPW TPMCHn TPMCHn tICPW Figure 16. Timer Input Capture Pulse 3.10.
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Electrical Characteristics Table 14. SPI Timing (continued) 1 No.
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Electrical Characteristics SS1 (OUTPUT) 11 1 2 SPSCK (CPOL = 0) (OUTPUT) 3 4 4 12 SPSCK (CPOL = 1) (OUTPUT) 5 MISO (INPUT) 6 MSB IN2 BIT 6 . . . 1 9 LSB IN 10 9 MOSI (OUTPUT) BIT 6 . . . 1 MSB OUT2 LSB OUT NOTES: 1. SS output mode (DDS7 = 1, SSOE = 1). 2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB. Figure 17.
PAGE 25
Electrical Characteristics SS (INPUT) 1 12 11 11 12 3 SPSCK (CPOL = 0) (INPUT) 2 4 4 SPSCK (CPOL = 1) (INPUT) 8 7 MISO (OUTPUT) MSB OUT SLAVE BIT 6 . . . 1 SLAVE LSB OUT SEE NOTE 6 5 MOSI (INPUT) 10 10 9 BIT 6 . . . 1 MSB IN LSB IN NOTE: 1. Not defined but normally MSB of character just received Figure 19.
PAGE 26
Electrical Characteristics 3.11 Analog Comparator (ACMP) Electricals Table 15. Analog Comparator Electrical Specifications C Characteristic Symbol Min Typical Max Unit VDD 1.8 — 3.6 V D Supply voltage P Supply current (active) IDDAC — 20 35 A D Analog input voltage VAIN VSS – 0.3 — VDD V P Analog input offset voltage VAIO — 20 40 mV C Analog comparator hysteresis VH 3.0 9.0 15.0 mV P Analog input leakage current IALKG — — 1.
PAGE 27
Electrical Characteristics SIMPLIFIED INPUT PIN EQUIVALENT CIRCUIT ZADIN SIMPLIFIED CHANNEL SELECT CIRCUIT Pad leakage due to input protection ZAS RAS ADC SAR ENGINE RADIN + VADIN VAS – CAS + – RADIN INPUT PIN RADIN INPUT PIN RADIN INPUT PIN CADIN Figure 21. ADC Input Impedance Equivalency Diagram Table 17.
PAGE 28
Electrical Characteristics Table 17. ADC Characteristics (VREFH = VDDAD, VREFL = VSSAD) (continued) Min Typ1 Max — 20 — — 40 — — 3.5 — — 23.5 — — 1.646 — — 1.769 — — 701.2 — — –1 to 3 –2.5 to 5.5 — –1 to 3 –3.0 to 6.5 10-bit mode — 1 2.5 P 8-bit mode — 0.5 1.0 T 12-bit mode — 1.0 –1.5 to 2.0 — 0.5 1.
PAGE 29
Electrical Characteristics Typical values assume VDDAD = 3.0 V, Temp = 25 C, fADCK = 1.0 MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 2 1 LSB = (VREFH – VREFL)/2N 3 Monotonicity and No-missing-codes guaranteed in 10-bit and 8-bit modes 4 Based on input pad leakage current. Refer to pad electricals. 1 3.13 Flash Specifications This section provides details about program/erase times and program-erase endurance for flash memory.
PAGE 30
Ordering Information 4 Ordering Information This section contains ordering information for the MC9S08QE32 series of MCUs. Example of the device numbering system: MC 9 S08 QE 32 C XX Status (MC = Fully Qualified) Package designator (see Table 19) Temperature range (C = –40 C to 85 C) Memory (9 = Flash-based) Core Approximate flash size in kbytes Family 5 Package Information Table 19. Package Descriptions Pin Count 5.1 Package Type Abbreviation Designator Case No. Document No.
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