Datasheet

Package Information
MC9S08MP16 Series Data Sheet, Rev. 2
Freescale Semiconductor 35
3.1 Device Numbering Scheme
Example of the device numbering system:
4 Package Information
The latest package outline drawings are available on the product summary pages on our web site:
http://www.freescale.com/8bit. The following table lists the document numbers per package. Use these numbers in the web
page’s keyword search engine to find the latest package outline drawings.
NOTE
The 32 LQFP and 28 SOIC are not qualified to meet automotive requirements.
5 Related Documentation
Find the most current versions of all documents at http://www.freescale.com.
6 Revision History
To provide the most up-to-date information, the revision of our documents on the World Wide Web are the most current. Your
printed copy may be an earlier revision. To verify you have the latest information available, refer to:
http://www.freescale.com
Table 23. Package Descriptions
Pin Count Package Type Abbreviation Designator Case No. Document No.
48 Low Quad Flat Pack LQFP LF 932-03 98ASH00962A
32 Low Quad Flat Pack LQFP LC 873A-03 98ASH70029A
28 Small Outline Integrated Circuit SOIC WL 751F-05 98ASB42345B
Reference Manual (MC9S08MP16RM)
Contains extensive product information including modes of operation, memory,
resets and interrupts, register definition, port pins, CPU, and all module
information.
xx
Temperature range
Family
Memory
Status
Core
9 = Flash-based
9S08 zz
MC = Consumer &
Package designator (see Table 2 3)
Flash size
nn y
V = –40C to 105C
S = Automotive Qualified
M = –40C to 125C
MP E2
Wafer fab site and mask revision
16 KBytes
12 KBytes
(this field appears only in automotive-qualified
part numbers)
Industrial
C = –40C to 85C