Datasheet

Electrical Characteristics
MC9S08MP16 Series Data Sheet, Rev. 2
Freescale Semiconductor 21
2.9 Internal Clock Source (ICS) Characteristics
5T
Crystal start-up time
4
ms
Low range, low gain (RANGE = 0, HGO = 0)
t
CSTL-LP
— 200 —
Low range, high gain (RANGE = 0, HGO = 1)
t
CSTL-HGO
— 400 —
High range, low gain (RANGE = 1, HGO = 0)
5
t
CSTH-LP
—5—
High range, high gain (RANGE = 1, HGO = 1)
4
t
CSTH-HGO
—20—
6T
Square wave input clock frequency (EREFS = 0, ERCLKEN = 1)
f
extal
FEE mode
2
0.03125 — 51.34 MHz
FBE mode
3
0—51.34MHz
FBELP mode 0 — 51.34 MHz
1
Typical data was characterized at 5.0 V, 25C or is recommended value.
2
The input clock source must be divided using RDIV to within the range of 31.25 kHz to 39.0625 kHz.
3
The input clock source must be divided using RDIV to less than or equal to 39.0625 kHz.
4
This parameter is characterized and not tested on each device. Proper PC board layout procedures must be followed to achieve
specifications.
5
4 MHz crystal
Table 10. ICS Frequency Specifications
Num C Characteristic Symbol Min Typ
1
Max Unit
1a P
Average internal reference frequency — factory trimmed
(consumer- and industrial-qualified devices)
at V
DD
= 5 V and temperature = 25C
f
int_t
— 32.768 — kHz
1b P
Average internal reference frequency — factory trimmed
(automotive-qualified devices)
at V
DD
= 5 V and temperature = 25C
f
int_t
— 31.25 — kHz
2P
Internal reference frequency — user trimmed f
int_t
31.25 — 39.06 kHz
3T
Internal reference start-up time t
irefst
— 60 100 s
Table 9. Oscillator Electrical Specifications (continued)
Num C Rating Symbol Min Typ
1
Max Unit
MCU
EXTAL XTAL
Crystal or Resonator
R
S
C
2
R
F
C
1