Datasheet
© Freescale Semiconductor, Inc., 2009-2012. All rights reserved.
Contents
Revision History
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The following revision history table summarizes changes contained in this document.
Related Documentation
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Rev Date Description of Changes
3 03/2009 Incorporated revisions for customer release.
4 08/2009 Completed all the TBDs; corrected Pin out in the Figure 2, Figure 3 and Tab l e 2; updated V
OH
,
|I
In
|, |I
OZ
|, R
PU
, R
PD
, added |I
INT
| in the Tabl e 8; updated Ta bl e 9 ; updated ERREFSTEN and
added LCD in the Ta b l e 1 0 ; updated f
ADACK
, E
TUE
, DNL, INL, E
ZS
and E
FS
in the Tabl e 1 8.
updated V Room Temp in the Ta ble 19 .
5 1/2010 Added 80-pin LQFP package information for MC9S08LL36.
6 6/2011 Changed the ERREFSTEN to EREFSTEN, updated the VREFOx to 1.15 V
Added LCD specification in the Ta bl e 1 0.
7 4/2012 Updated |I
In
| in the Ta bl e 8 .
Reference Manual —MC9S08LL64RM
Contains extensive product information including modes of operation, memory,
resets and interrupts, register definition, port pins, CPU, and all module
information.
1 Devices in the MC9S08LL64 Series. . . . . . . . . . . . . . . . . . . . . 3
2 Pin Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.2 Parameter Classification. . . . . . . . . . . . . . . . . . . . . . . . . 9
3.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . 9
3.4 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 10
3.5 ESD Protection and Latch-Up Immunity . . . . . . . . . . . . 11
3.6 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.7 Supply Current Characteristics. . . . . . . . . . . . . . . . . . . 23
3.8 External Oscillator (XOSCVLP) Characteristics . . . . . . 25
3.9 Internal Clock Source (ICS) Characteristics . . . . . . . . . 26
3.10 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.10.1 Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.10.2 TPM Module Timing. . . . . . . . . . . . . . . . . . . . . .29
3.10.3 SPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
3.11 Analog Comparator (ACMP) Electricals . . . . . . . . . . . .33
3.12 ADC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .33
3.13 VREF Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .38
3.14 LCD Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
3.15 Flash Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .39
3.16 EMC Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
3.16.1 Radiated Emissions . . . . . . . . . . . . . . . . . . . . . .40
4 Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
4.1 Device Numbering System . . . . . . . . . . . . . . . . . . . . . .41
4.2 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . .41
4.3 Mechanical Drawings . . . . . . . . . . . . . . . . . . . . . . . . . .41