Datasheet

Device Numbering System
MC9S08LL64 Series MCU Data Sheet, Rev. 7
Freescale Semiconductor 41
4.1 Device Numbering System
Example of the device numbering system:
4.2 Package Information
4.3 Mechanical Drawings
Table 23 provides the available package types and their document numbers. The latest package
outline/mechanical drawings are available on the MC9S08LL64 series Product Summary pages at
http://www.freescale.com.
To view the latest drawing, either:
• Click on the appropriate link in Table 23, or
• Open a browser to the Freescale website (http://www.freescale.com), and enter the appropriate
document number (from Table 23) in the “Enter Keyword” search box at the top of the page.
Table 22. Device Numbering System
Device Number
1
1
See Tabl e 1 for a complete description of modules included on each device.
Memory
Available Packages
2
2
See Tabl e 23 for package information.
Flash RAM
MC9S08LL64
64 KB 4000 80 LQFP
64 KB 4000 64 LQFP
MC9S08LL36
36 KB 4000 80 LQFP
36 KB 4000 64 LQFP
Table 23. Package Descriptions
Pin Count Package Type Abbreviation Designator Case No. Document No.
80 Low Quad Flat Package LQFP LK 917A 98ASS23237W
64 Low Quad Flat Package LQFP LH 840F 98ASS23234W
MC
Temperature range
Family
Memory
Status
Core
(C = –40 °C to 85 °C)
(9 = Flash-based)
9
S08
(MC = Fully qualified)
Package designator (see Ta bl e 2 3)
Approximate flash size in KB
LL
64 C
XX