Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsMicrocontrollers, Microprocessors & QuartzesEmbedded microcontroller LQFP 64 (10x10) 8-Bit 20 MHz I/O number 38

64-LQFP

Case 840F

48-LQFP

Case 932

48-QFN

1314

Features

• 8-Bit HCS08 Central Processor Unit (CPU)

– Up to 20-MHz CPU at 3.6V to 1.8V across temperature range

of -40°C to 85°C

– HC08 instruction set with added BGND instruction

– Support for up to 32 interrupt/reset sources

• On-Chip Memory

– Dual Array FLASH read/program/erase over full operating

voltage and temperature

– Random-access memory (RAM)

– Security circuitry to prevent unauthorized access to RAM and

FLASH contents

• Power-Saving Modes

– Two low power stop modes

– Reduced power wait mode

– Low power run and wait modes allow peripherals to run while

voltage regulator is in standby

– Peripheral clock gating register can disable clocks to unused

modules, thereby reducing currents.

– Very low power external oscillator that can be used in stop2 or

stop3 modes to provide accurate clock source to real time

counter

– 6 usec typical wake up time from stop3 mode

• Clock Source Options

– Oscillator (XOSC) — Loop-control Pierce oscillator; Crystal

or ceramic resonator range of 31.25 kHz to 38.4 kHz or 1 MHz

to 16 MHz

– Internal Clock Source (ICS) — Internal clock source module

containing a frequency-locked-loop (FLL) controlled by

internal or external reference; precision trimming of internal

reference allows 0.2% resolution and 2% deviation over

temperature and voltage; supports bus frequencies from 1MHz

to 10 MHz.

• System Protection

– Watchdog computer operating properly (COP) reset with

option to run from dedicated 1-kHz internal clock source or

bus clock

– Low-Voltage Warning with interrupt

– Low-Voltage Detection with reset or interrupt

– Illegal opcode and illegal address detection with reset

– Flash block protection

• Development Support

– Single-wire background debug interface

– Breakpoint capability to allow single breakpoint setting during

in-circuit debugging (plus two more breakpoints in on-chip

debug module)

– On-chip in-circuit emulator (ICE) debug module containing

three comparators and nine trigger modes. Eight deep FIFO for

storing change-of-flow addresses and event-only data. Debug

module supports both tag and force breakpoints

•Peripherals

– LCD — 4x28 or 8x24 LCD driver with internal charge pump

and option to provide an internally regulated LCD reference

that can be trimmed for contrast control.

– ADC — 8-channel, 12-bit resolution; 2.5 μs conversion time;

automatic compare function; temperature sensor; internal

bandgap reference channel; operation in stop3; fully functional

from 3.6V to 1.8V

– ACMP — Analog comparator with selectable interrupt on

rising, falling, or either edge of comparator output; compare

option to fixed internal bandgap reference voltage; outputs can

be optionally routed to TPM module; operation in stop3

– SCI — Full duplex non-return to zero (NRZ); LIN master

extended break generation; LIN slave extended break

detection; wake up on active edge

– SPI— Full-duplex or single-wire bidirectional;

Double-buffered transmit and receive; Master or Slave mode;

MSB-first or LSB-first shifting

– IIC — IIC with up to 100 kbps with maximum bus loading;

Multi-master operation; Programmable slave address;

Interrupt driven byte-by-byte data transfer; supports broadcast

mode and 10-bit addressing

– TPMx — Two 2-channel (TPM1 and TPM2); Selectable input

capture, output compare, or buffered edge- or center-aligned

PWM on each channel;

– TOD— (Time Of Day) 8-bit quarter second counter with

match register; External clock source for precise time base,

time-of-day, calendar or task scheduling functions; Free

running on-chip low power oscillator (1 kHz) for cyclic

wake-up without external components.

• Input/Output

– 38 GPIOs, 2 output-only pins

– 8 KBI interrupts with selectable polarity

– Hysteresis and configurable pull up device on all input pins;

Configurable slew rate and drive strength on all output pins.

• Package Options

– 64-LQFP, 48-LQFP and 48-QFN

Freescale Semiconductor

Data Sheet: Technical Data

An Energy Efficient Solution by Freescale

Document Number: MC9S08LL16

Rev. 7, 1/2013

MC9S08LL16 Series

Covers: MC9S08LL16 and

MC9S08LL8

Summary of content (44 pages)

PAGE 1
Freescale Semiconductor Data Sheet: Technical Data Document Number: MC9S08LL16 Rev. 7, 1/2013 An Energy Efficient Solution by Freescale MC9S08LL16 Series Covers: MC9S08LL16 and MC9S08LL8 Features • 8-Bit HCS08 Central Processor Unit (CPU) – Up to 20-MHz CPU at 3.6V to 1.
PAGE 2
Table of Contents 1 2 3 Devices in the MC9S08LL16 Series . . . . . . . . . . . . . . 4 Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . 9 3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.2 Parameter Classification . . . . . . . . . . . . . . . . . . . 9 3.3 Absolute Maximum Ratings. . . . . . . . . . . . . . . . 10 3.4 Thermal Characteristics. . . . . . . . . . . . . . . . . . .
PAGE 3
Related Documentation Find the most current versions of all documents at: http://www.freescale.com Reference Manual (MC9S08LL16RM) Contains extensive product information including modes of operation, memory, resets and interrupts, register definition, port pins, CPU, and all module information. MC9S08LL16 Series MCU Data Sheet, Rev.
PAGE 4
Devices in the MC9S08LL16 Series 1 Devices in the MC9S08LL16 Series Table 1 summarizes the feature set available in the MC9S08LL16 series of MCUs. Table 1.
PAGE 5
Devices in the MC9S08LL16 Series HCS08 CORE ON-CHIP ICE DEBUG MODULE (DBG) BKGD BKP TIME OF DAY MODULE (TOD) HCS08 SYSTEM CONTROL RESETS AND INTERRUPTS MODES OF OPERATION POWER MANAGEMENT COP IRQ LVD PTA1/KBIP1/SPSCK/ADP1 PORT A INT 8-BIT KEYBOARD INTERRUPT (KBI) RESET SERIAL PERIPHERAL INTERFACE (SPI) SS SPSCK MISO PTB7/SS PTB6/SPSCK MOSI SCL IRQ IIC MODULE (IIC) 2-CHANNEL TIMER/PWM (TPM2) SDA TPM2CH1 TCLK TPM1CH0 USER FLASH B (LL16 = 8K BYTES) (LL8 = 2K BYTES) 2-CHANNEL TIMER/PWM (T
PAGE 6
Pin Assignments 2 Pin Assignments 64-Pin LQFP 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 LCD26 LCD27 LCD28 LCD29 PTA5/KBIP5/ADP5/LCD30 PTA4/KBIP4/ADP4/LCD31 PTA3/KBIP3/SCL/MOSI/ADP3 PTA2/KBIP2/SDA/MISO/ADP2 PTA1/KBIP1/SPSCK/ADP1 PTA0/KBIP0/SS/ADP0 PTC7/IRQ/TCLK PTC6/ACMPO/BKGD/MS PTC5/TPM2CH1 PTC4/TPM2CH0 PTC3/TPM1CH1 PTC2/TPM1CH0 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 PTA6/KBIP6/ADP6/ACMP+ PTA7/KBIP7/ADP7/ACMP– VSSA/VREFL VDDA/VREFH PTB0/EXTAL PT
PAGE 7
37 48 PTD7/LCD7 47 1 LCD27 LCD26 LCD25 LCD24 PTE7/LCD15 PTE6/LCD14 PTE5/LCD13 PTE4/LCD12 PTE3/LCD11 PTE2/LCD10 PTE1/LCD9 PTE0/LCD8 Pin Assignments 46 45 44 43 42 41 40 39 38 36 LCD28 PTD6/LCD6 2 35 LCD29 PTD5/LCD5 3 34 PTA5/KBIP5/ADP5/LCD30 PTD4/LCD4/ 4 33 PTA4/KBIP4/ADP4/LCD31 PTD3/LCD3 5 32 PTA3/KBIP3/SCL/MOSI/ADP3 PTD2/LCD2 6 31 PTA2/KBIP2/SDA/MISO/ADP2 PTD1/LCD1 7 30 PTA1/KBIP1/SPSCK/ADP1 PTD0/LCD0 8 29 PTA0/KBIP0/SS/ADP0 9 28 PTC7/IRQ/TCLK VCAP2
PAGE 8
Pin Assignments Table 2.
PAGE 9
Electrical Characteristics Table 2.
PAGE 10
Electrical Characteristics Table 3. Parameter Classifications P Those parameters are guaranteed during production testing on each individual device. C Those parameters are achieved by the design characterization by measuring a statistically relevant sample size across process variations. T Those parameters are achieved by design characterization on a small sample size from typical devices under typical conditions unless otherwise noted. All values shown in the typical column are within this category.
PAGE 11
Electrical Characteristics 3.4 Thermal Characteristics This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits, and it is user-determined rather than being controlled by the MCU design.
PAGE 12
Electrical Characteristics where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving Equation 3-1 and Equation 3-2 iteratively for any value of TA. 3.
PAGE 13
Electrical Characteristics 3.6 DC Characteristics This section includes information about power supply requirements and I/O pin characteristics. Table 8.
PAGE 14
Electrical Characteristics Table 8. DC Characteristics (continued) Num C Characteristic Symbol all input only pins except for LCD only pins (LCD 16-29) 11 P Input leakage current |IIn| LCD only pins (LCD 16-29) 12 Hi-Z (off-state) P leakage current 13 P 14 P Pullup, pulldown resistors when P enabled 2 3 4 5 6 7 8 DC injection current 4, 5, 6 Min Typ1 Max Unit VIn = VDD — 0.025 1 μA VIn = VSS — 0.025 1 μA VIn = VDD — 100 150 μA VIn = VSS — 0.025 1 μA 0.
PAGE 15
Electrical Characteristics Figure 4. Non-LCD pins I/O Pullup and Pulldown Typical Resistor Values (VDD = 3.0 V) MC9S08LL16 Series MCU Data Sheet, Rev.
PAGE 16
Electrical Characteristics Figure 5. LCD/GPIO Pins I/O Pullup/Pulldown Typical Resistor Values MC9S08LL16 Series MCU Data Sheet, Rev.
PAGE 17
Electrical Characteristics Figure 6. Typical Low-Side Driver (Sink) Characteristics (Non-LCD pins) — Low Drive (PTxDSn = 0) MC9S08LL16 Series MCU Data Sheet, Rev.
PAGE 18
Electrical Characteristics Figure 7. Typical Low-Side Driver (Sink) Characteristics(Non-LCD pins) — High Drive (PTxDSn = 1) MC9S08LL16 Series MCU Data Sheet, Rev.
PAGE 19
Electrical Characteristics Figure 8. Typical High-Side (Source) Characteristics (Non-LCD Pins) — Low Drive (PTxDSn = 0) MC9S08LL16 Series MCU Data Sheet, Rev.
PAGE 20
Electrical Characteristics Figure 9. Typical High-Side (Source) Characteristics(Non-LCD Pins) — High Drive (PTxDSn = 1) MC9S08LL16 Series MCU Data Sheet, Rev.
PAGE 21
Electrical Characteristics Preliminary IOL (mA) Figure 10. Typical Low-Side Driver (Sink) Characteristics (LCD/GPIO Pins) — Low Drive (PTxDSn = 0) MC9S08LL16 Series MCU Data Sheet, Rev.
PAGE 22
Electrical Characteristics Figure 11. Typical Low-Side Driver (Sink) Characteristics(LCD/GPIO Pins) — High Drive (PTxDSn = 1) MC9S08LL16 Series MCU Data Sheet, Rev.
PAGE 23
Electrical Characteristics Figure 12. Typical High-Side (Source) Characteristics (LCD/GPIO Pins) — Low Drive (PTxDSn = 0) MC9S08LL16 Series MCU Data Sheet, Rev.
PAGE 24
Electrical Characteristics Figure 13. Typical High-Side (Source) Characteristics(LCD/GPIO pins) — High Drive (PTxDSn = 1) MC9S08LL16 Series MCU Data Sheet, Rev.
PAGE 25
Electrical Characteristics 3.7 Supply Current Characteristics This section includes information about power supply current in various operating modes. Table 9.
PAGE 26
Electrical Characteristics Table 9. Supply Current Characteristics (continued) 1 2 Num C 10 C 11 C Parameter Symbol Bus Freq VDD (V) Typ1 Max Unit Temp (°C) Application Stop3 mode supply current2 ApS3IDD n/a 3 6.1 — μA 25 °C Application Stop3 mode supply current2 ApS3IDD n/a 3 7.5 — μA 50 °C Typical values are measured at 25 °C. Characterized, not tested. 32 kHz crystal enabled in low power mode. TOD module enabled.
PAGE 27
Electrical Characteristics 3.8 External Oscillator (XOSCVLP) Characteristics Refer to Figure 14 and Figure 15 for crystal or resonator circuits. Table 11.
PAGE 28
Electrical Characteristics XOSCVLP EXTAL XTAL RS RF C1 Crystal or Resonator C2 Figure 14. Typical Crystal or Resonator Circuit: High Range and Low Range/High Gain XOSCVLP EXTAL XTAL Crystal or Resonator Figure 15. Typical Crystal or Resonator Circuit: Low Range/Low Power 3.9 Internal Clock Source (ICS) Characteristics Table 12.
PAGE 29
Electrical Characteristics Table 12. ICS Frequency Specifications (Temperature Range = –40 to 85°C Ambient) (continued) Num C Characteristic 9 C 10 C FLL acquisition time 2 11 C Total deviation from trimmed DCO output frequency over fixed voltage and temperature range of 0°C to 70 °C Long term jitter of DCO output clock (averaged over 2-ms interval) 3 Symbol Min Typ1 Max Unit Δfdco_t — ±0.5 ±1 %fdco tAcquire — — 1 ms CJitter — 0.02 0.
PAGE 30
Electrical Characteristics 3.10 AC Characteristics This section describes timing characteristics for each peripheral system. 3.10.1 Control Timing Table 13.
PAGE 31
Electrical Characteristics textrst RESET PIN Figure 17. Reset Timing tIHIL IRQ/KBIPx IRQ/KBIPx tILIH Figure 18. IRQ/KBIPx Timing 3.10.2 TPM Module Timing Synchronizer circuits determine the shortest input pulses that can be recognized or the fastest clock that can be used as the optional external source to the timer counter. These synchronizers operate from the current bus rate clock. Table 14. TP Input Timing No.
PAGE 32
Electrical Characteristics tICPW TPMCHn TPMCHn tICPW Figure 20. Timer Input Capture Pulse 3.10.3 SPI Timing Table 15 and Figure 21 through Figure 24 describe the timing requirements for the SPI system. Table 15. SPI Timing No.
PAGE 33
Electrical Characteristics Table 15. SPI Timing (continued) No. C Function Symbol Min Max Unit 10 D Data hold time (outputs) Master Slave tHO 0 0 — — ns ns 11 D Rise time Input Output tRI tRO — — tcyc – 25 25 ns ns 12 D Fall time Input Output tFI tFO — — tcyc – 25 25 ns ns SS1 (OUTPUT) 1 2 SPSCK (CPOL = 0) (OUTPUT) 11 3 4 4 12 SPSCK (CPOL = 1) (OUTPUT) 5 MISO (INPUT) 6 MS BIN2 9 MOSI (OUTPUT) BIT 6 . . . 1 LSB IN 9 MSB OUT2 BIT 6 . . . 1 10 LSB OUT NOTES: 1.
PAGE 34
Electrical Characteristics SS1 (OUTPUT) 1 2 12 11 11 12 3 SPSCK (CPOL = 0) (OUTPUT) 4 SPSCK (CPOL = 1) (OUTPUT) 4 5 MISO (INPUT) 6 MSB IN2 BIT 6 . . . 1 9 LSB IN 10 MOSI (OUTPUT) PORT DATA BIT 6 . . . 1 MASTER MSB OUT2 MASTER LSB OUT PORT DATA NOTES: 1. SS output mode (DDS7 = 1, SSOE = 1). 2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB. Figure 22.
PAGE 35
Electrical Characteristics SS (INPUT) 1 3 2 SPSCK (CPOL = 0) (INPUT) 4 SPSCK (CPOL = 1) (INPUT) 4 9 MISO (OUTPUT) SEE NOTE 1 MSB OUT 5 7 11 11 12 10 SLAVE MOSI (INPUT) 12 8 BIT 6 . . . 1 SLAVE LSB OUT 6 MSB IN BIT 6 . . . 1 LSB IN NOTE: 1. Not defined but normally LSB of character just received. Figure 24. SPI Slave Timing (CPHA = 1) 3.11 Analog Comparator (ACMP) Electricals Table 16.
PAGE 36
Electrical Characteristics Table 17. 12-bit ADC Operating Conditions Symb Min Typ1 Max Unit Ref Voltage High VREFH 1.8 VDDA VDDA V Input Voltage VADIN VREFL — VREFH V Input Capacitance CADIN — 4.5 5.5 pF Input Resistance RADIN — 5 7 kΩ — — — — 2 5 — — — — 5 10 — — 10 0.4 — 8.0 0.4 — 4.
PAGE 37
Electrical Characteristics Table 18. 12-bit ADC Characteristics (VREFH = VDDA, VREFL = VSSA) Symb Min Typ1 Max Unit T Supply Current ADLPC=1 ADLSMP=1 ADCO=1 IDDA — 120 — μA T Supply Current ADLPC=1 ADLSMP=0 ADCO=1 IDDA — 200 — μA T Supply Current ADLPC=0 ADLSMP=1 ADCO=1 IDDA — 290 — μA P Supply Current ADLPC=0 ADLSMP=0 ADCO=1 IDDA — 0.53 1 mA 2 3.
PAGE 38
Electrical Characteristics Table 18. 12-bit ADC Characteristics (VREFH = VDDA, VREFL = VSSA) (continued) C Characteristic T P Conditions Symb 12-bit mode Zero-Scale Error 10-bit mode EZS Min Typ1 Max — ±1.5 ±2.5 — ±0.5 ±1.5 T 8-bit mode — ±0.5 ±0.5 T 12-bit mode — ±1 –3.5 to 1.0 — ±0.5 ±1 8-bit mode — ±0.5 ±0.5 12-bit mode — –1 to 0 — — — ±0.5 8-bit mode — — ±0.5 12-bit mode — ±2 — — ±0.2 ±4 — ±0.1 ±1.2 — 1.646 — — 1.769 — — 701.
PAGE 39
Electrical Characteristics 3.13 LCD Specifications Table 19. LCD Electricals, 3 V Glass C D Characteristic LCD Supply Voltage Symbol Min Typ Max VLCD 0.9 1.5 1.8 28 D LCD Frame Frequency fFrame D LCD Charge Pump Capacitance CLCD D LCD Bypass Capacitance D LCD Glass Capacitance D VIREG HRefSel = 0 VIREG TRIM Resolution D VIREG Ripple D 1 2 30 58 Hz 100 100 nF 100 100 nF Cglass 2000 8000 pF VIREG .89 1.00 1.15 1.49 1.67 1.
PAGE 40
Electrical Characteristics Table 20. Flash Characteristics C Characteristic Symbol Min Typical Max Unit D Supply voltage for program/erase -40°C to 85°C Vprog/erase 1.8 3.6 V D Supply voltage for read operation VRead 1.8 3.6 V fFCLK 150 200 kHz tFcyc 5 6.
PAGE 41
Ordering Information The maximum radiated RF emissions of the tested configuration in all orientations are less than or equal to the reported emissions levels. Table 21. Radiated Emissions, Electric Field Parameter Symbol Conditions Frequency fOSC/fBUS VRE_TEM VDD = 3.3 V TA = 25 oC package type 64-pin LQFP 0.
PAGE 42
Package Information and Mechanical Drawings Table 22. Package Descriptions Pin Count Abbreviation Designator Case No. Document No. Low Quad Flat Package LQFP LH 840F 98ASS23234W 48 Low Quad Flat Package LQFP LF 932 98ASH00962A 48 Quad Flat No-Leads QFN GT 1314 98ARH99048A 64 Package Type MC9S08LL16 Series MCU Data Sheet, Rev.
PAGE 43
Package Information and Mechanical Drawings MC9S08LL16 Series MCU Data Sheet, Rev.
PAGE 44
How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.