Datasheet

MC9S08FL16 Series Data Sheet, Rev. 3
Package Information
Freescale Semiconductor28
Example of the device numbering system:
7 Package Information
7.1 Mechanical Drawings
The following pages are mechanical drawings for the packages described in Table 17.
1
See the reference manual, MC9S08FL16 Series Reference Manual, for a complete
description of modules included on each device.
2
See Table 1 7 for package information.
Table 17. Package Descriptions
Pin Count Package Type Abbreviation Designator Case No. Document No.
32 Low Quad Flat Package LQFP LC 873A-03 98ASH70029A
32 Shrink Dual In-line Package SDIP BM 1376-02 98ASA99330D
MC
Temperature range
Family
Memory
Status
Core
(C =–40 C to 85 C)
(9 = Flash-based)
9
S08
XX
(MC = Fully Qualified)
Package designator (see Ta bl e 1 7)
Approximate flash size in KB
FL
16 C