Datasheet
Table Of Contents
- Chapter 1 Device Overview
- Chapter 2 Pins and Connections
- Chapter 3 Modes of Operation
- Chapter 4 Memory
- 4.1 MC9S08DN60 Series Memory Map
- 4.2 Reset and Interrupt Vector Assignments
- 4.3 Register Addresses and Bit Assignments
- 4.4 RAM
- 4.5 Flash and EEPROM
- 4.5.1 Features
- 4.5.2 Program and Erase Times
- 4.5.3 Program and Erase Command Execution
- 4.5.4 Burst Program Execution
- 4.5.5 Sector Erase Abort
- 4.5.6 Access Errors
- 4.5.7 Block Protection
- 4.5.8 Vector Redirection
- 4.5.9 Security
- 4.5.10 EEPROM Mapping
- 4.5.11 Flash and EEPROM Registers and Control Bits
- 4.5.11.1 Flash and EEPROM Clock Divider Register (FCDIV)
- 4.5.11.2 Flash and EEPROM Options Register (FOPT and NVOPT)
- 4.5.11.3 Flash and EEPROM Configuration Register (FCNFG)
- 4.5.11.4 Flash and EEPROM Protection Register (FPROT and NVPROT)
- 4.5.11.5 Flash and EEPROM Status Register (FSTAT)
- 4.5.11.6 Flash and EEPROM Command Register (FCMD)
- Chapter 5 Resets, Interrupts, and General System Control
- 5.1 Introduction
- 5.2 Features
- 5.3 MCU Reset
- 5.4 Computer Operating Properly (COP) Watchdog
- 5.5 Interrupts
- 5.6 Low-Voltage Detect (LVD) System
- 5.7 MCLK Output
- 5.8 Reset, Interrupt, and System Control Registers and Control Bits
- 5.8.1 Interrupt Pin Request Status and Control Register (IRQSC)
- 5.8.2 System Reset Status Register (SRS)
- 5.8.3 System Background Debug Force Reset Register (SBDFR)
- 5.8.4 System Options Register 1 (SOPT1)
- 5.8.5 System Options Register 2 (SOPT2)
- 5.8.6 System Device Identification Register (SDIDH, SDIDL)
- 5.8.7 System Power Management Status and Control 1 Register (SPMSC1)
- 5.8.8 System Power Management Status and Control 2 Register (SPMSC2)
- Chapter 6 Parallel Input/Output Control
- 6.1 Port Data and Data Direction
- 6.2 Pull-up, Slew Rate, and Drive Strength
- 6.3 Pin Interrupts
- 6.4 Pin Behavior in Stop Modes
- 6.5 Parallel I/O and Pin Control Registers
- 6.5.1 Port A Registers
- 6.5.1.1 Port A Data Register (PTAD)
- 6.5.1.2 Port A Data Direction Register (PTADD)
- 6.5.1.3 Port A Pull Enable Register (PTAPE)
- 6.5.1.4 Port A Slew Rate Enable Register (PTASE)
- 6.5.1.5 Port A Drive Strength Selection Register (PTADS)
- 6.5.1.6 Port A Interrupt Status and Control Register (PTASC)
- 6.5.1.7 Port A Interrupt Pin Select Register (PTAPS)
- 6.5.1.8 Port A Interrupt Edge Select Register (PTAES)
- 6.5.2 Port B Registers
- 6.5.2.1 Port B Data Register (PTBD)
- 6.5.2.2 Port B Data Direction Register (PTBDD)
- 6.5.2.3 Port B Pull Enable Register (PTBPE)
- 6.5.2.4 Port B Slew Rate Enable Register (PTBSE)
- 6.5.2.5 Port B Drive Strength Selection Register (PTBDS)
- 6.5.2.6 Port B Interrupt Status and Control Register (PTBSC)
- 6.5.2.7 Port B Interrupt Pin Select Register (PTBPS)
- 6.5.2.8 Port B Interrupt Edge Select Register (PTBES)
- 6.5.3 Port C Registers
- 6.5.4 Port D Registers
- 6.5.4.1 Port D Data Register (PTDD)
- 6.5.4.2 Port D Data Direction Register (PTDDD)
- 6.5.4.3 Port D Pull Enable Register (PTDPE)
- 6.5.4.4 Port D Slew Rate Enable Register (PTDSE)
- 6.5.4.5 Port D Drive Strength Selection Register (PTDDS)
- 6.5.4.6 Port D Interrupt Status and Control Register (PTDSC)
- 6.5.4.7 Port D Interrupt Pin Select Register (PTDPS)
- 6.5.4.8 Port D Interrupt Edge Select Register (PTDES)
- 6.5.5 Port E Registers
- 6.5.6 Port F Registers
- 6.5.7 Port G Registers
- 6.5.1 Port A Registers
- Chapter 7 Central Processor Unit (S08CPUV3)
- 7.1 Introduction
- 7.2 Programmer’s Model and CPU Registers
- 7.3 Addressing Modes
- 7.4 Special Operations
- 7.5 HCS08 Instruction Set Summary
- Chapter 8 Multi-Purpose Clock Generator (S08MCGV1)
- 8.1 Introduction
- 8.2 External Signal Description
- 8.3 Register Definition
- 8.4 Functional Description
- 8.4.1 Operational Modes
- 8.4.1.1 FLL Engaged Internal (FEI)
- 8.4.1.2 FLL Engaged External (FEE)
- 8.4.1.3 FLL Bypassed Internal (FBI)
- 8.4.1.4 FLL Bypassed External (FBE)
- 8.4.1.5 PLL Engaged External (PEE)
- 8.4.1.6 PLL Bypassed External (PBE)
- 8.4.1.7 Bypassed Low Power Internal (BLPI)
- 8.4.1.8 Bypassed Low Power External (BLPE)
- 8.4.1.9 Stop
- 8.4.2 Mode Switching
- 8.4.3 Bus Frequency Divider
- 8.4.4 Low Power Bit Usage
- 8.4.5 Internal Reference Clock
- 8.4.6 External Reference Clock
- 8.4.7 Fixed Frequency Clock
- 8.4.1 Operational Modes
- 8.5 Initialization / Application Information
- 8.5.1 MCG Module Initialization Sequence
- 8.5.2 MCG Mode Switching
- 8.5.2.1 Example # 1: Moving from FEI to PEE Mode: External Crystal = 4 MHz, Bus Frequency = 8 MHz
- 8.5.2.2 Example # 2: Moving from PEE to BLPI Mode: External Crystal = 4 MHz, Bus Frequency =16 kHz
- 8.5.2.3 Example #3: Moving from BLPI to FEE Mode: External Crystal = 4 MHz, Bus Frequency = 16 MHz
- 8.5.2.4 Example # 4: Moving from FEI to PEE Mode: External Crystal = 8 MHz, Bus Frequency = 8 MHz
- 8.5.3 Calibrating the Internal Reference Clock (IRC)
- Chapter 9 Analog Comparator (S08ACMPV3)
- Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
- 10.1 Introduction
- 10.2 External Signal Description
- 10.3 Register Definition
- 10.3.1 Status and Control Register 1 (ADCSC1)
- 10.3.2 Status and Control Register 2 (ADCSC2)
- 10.3.3 Data Result High Register (ADCRH)
- 10.3.4 Data Result Low Register (ADCRL)
- 10.3.5 Compare Value High Register (ADCCVH)
- 10.3.6 Compare Value Low Register (ADCCVL)
- 10.3.7 Configuration Register (ADCCFG)
- 10.3.8 Pin Control 1 Register (APCTL1)
- 10.3.9 Pin Control 2 Register (APCTL2)
- 10.3.10 Pin Control 3 Register (APCTL3)
- 10.4 Functional Description
- 10.5 Initialization Information
- 10.6 Application Information
- Chapter 11 Inter-Integrated Circuit (S08IICV2)
- Chapter 12 Serial Peripheral Interface (S08SPIV3)
- Chapter 13 Serial Communications Interface (S08SCIV4)
- Chapter 14 Real-Time Counter (S08RTCV1)
- Chapter 15 Timer Pulse-Width Modulator (S08TPMV3)
- Chapter 16 Development Support
- 16.1 Introduction
- 16.2 Background Debug Controller (BDC)
- 16.3 On-Chip Debug System (DBG)
- 16.4 Register Definition
- 16.4.1 BDC Registers and Control Bits
- 16.4.2 System Background Debug Force Reset Register (SBDFR)
- 16.4.3 DBG Registers and Control Bits
- 16.4.3.1 Debug Comparator A High Register (DBGCAH)
- 16.4.3.2 Debug Comparator A Low Register (DBGCAL)
- 16.4.3.3 Debug Comparator B High Register (DBGCBH)
- 16.4.3.4 Debug Comparator B Low Register (DBGCBL)
- 16.4.3.5 Debug FIFO High Register (DBGFH)
- 16.4.3.6 Debug FIFO Low Register (DBGFL)
- 16.4.3.7 Debug Control Register (DBGC)
- 16.4.3.8 Debug Trigger Register (DBGT)
- 16.4.3.9 Debug Status Register (DBGS)
- Appendix A Electrical Characteristics
- A.1 Introduction
- A.2 Parameter Classification
- A.3 Absolute Maximum Ratings
- A.4 Thermal Characteristics
- A.5 ESD Protection and Latch-Up Immunity
- A.6 DC Characteristics
- A.7 Supply Current Characteristics
- A.8 Analog Comparator (ACMP) Electricals
- A.9 ADC Characteristics
- A.10 External Oscillator (XOSC) Characteristics
- A.11 MCG Specifications
- A.12 AC Characteristics
- A.13 Flash and EEPROM
- A.14 EMC Performance
- Appendix B Timer Pulse-Width Modulator (TPMV2)
- Appendix C Ordering Information and Mechanical Drawings

Chapter 5 Resets, Interrupts, and General System Control
MC9S08DN60 Series Data Sheet, Rev 3
66 Freescale Semiconductor
5.5.1 Interrupt Stack Frame
Figure 5-1 shows the contents and organization of a stack frame. Before the interrupt, the stack pointer
(SP) points at the next available byte location on the stack. The current values of CPU registers are stored
on the stack starting with the low-order byte of the program counter (PCL) and ending with the CCR. After
stacking, the SP points at the next available location on the stack which is the address that is one less than
the address where the CCR was saved. The PC value that is stacked is the address of the instruction in the
main program that would have executed next if the interrupt had not occurred.
Figure 5-1. Interrupt Stack Frame
When an RTI instruction is executed, these values are recovered from the stack in reverse order. As part of
the RTI sequence, the CPU fills the instruction pipeline by reading three bytes of program information,
starting from the PC address recovered from the stack.
The status flag corresponding to the interrupt source must be acknowledged (cleared) before returning
from the ISR. Typically, the flag is cleared at the beginning of the ISR so that if another interrupt is
generated by this same source, it will be registered so it can be serviced after completion of the current ISR.
5.5.2 External Interrupt Request (IRQ) Pin
External interrupts are managed by the IRQ status and control register, IRQSC. When the IRQ function is
enabled, synchronous logic monitors the pin for edge-only or edge-and-level events. When the MCU is in
stop mode and system clocks are shut down, a separate asynchronous path is used so the IRQ (if enabled)
can wake the MCU.
5.5.2.1 Pin Configuration Options
The IRQ pin enable (IRQPE) control bit in IRQSC must be 1 in order for the IRQ pin to act as the interrupt
request (IRQ) input. As an IRQ input, the user can choose the polarity of edges or levels detected
(IRQEDG), whether the pin detects edges-only or edges and levels (IRQMOD), and whether an event
causes an interrupt or only sets the IRQF flag which can be polled by software.
CONDITION CODE REGISTER
ACCUMULATOR
INDEX REGISTER (LOW BYTE X)
PROGRAM COUNTER HIGH
* High byte (H) of index register is not automatically stacked.
*
PROGRAM COUNTER LOW
70
UNSTACKING
ORDER
STACKING
ORDER
5
4
3
2
1
1
2
3
4
5
TOWARD LOWER ADDRESSES
TOWARD HIGHER ADDRESSES
SP BEFORE
SP AFTER
INTERRUPT STACKING
THE INTERRUPT