Datasheet
Table Of Contents
- Chapter 1 Device Overview
- Chapter 2 Pins and Connections
- Chapter 3 Modes of Operation
- Chapter 4 Memory
- 4.1 MC9S08DN60 Series Memory Map
- 4.2 Reset and Interrupt Vector Assignments
- 4.3 Register Addresses and Bit Assignments
- 4.4 RAM
- 4.5 Flash and EEPROM
- 4.5.1 Features
- 4.5.2 Program and Erase Times
- 4.5.3 Program and Erase Command Execution
- 4.5.4 Burst Program Execution
- 4.5.5 Sector Erase Abort
- 4.5.6 Access Errors
- 4.5.7 Block Protection
- 4.5.8 Vector Redirection
- 4.5.9 Security
- 4.5.10 EEPROM Mapping
- 4.5.11 Flash and EEPROM Registers and Control Bits
- 4.5.11.1 Flash and EEPROM Clock Divider Register (FCDIV)
- 4.5.11.2 Flash and EEPROM Options Register (FOPT and NVOPT)
- 4.5.11.3 Flash and EEPROM Configuration Register (FCNFG)
- 4.5.11.4 Flash and EEPROM Protection Register (FPROT and NVPROT)
- 4.5.11.5 Flash and EEPROM Status Register (FSTAT)
- 4.5.11.6 Flash and EEPROM Command Register (FCMD)
- Chapter 5 Resets, Interrupts, and General System Control
- 5.1 Introduction
- 5.2 Features
- 5.3 MCU Reset
- 5.4 Computer Operating Properly (COP) Watchdog
- 5.5 Interrupts
- 5.6 Low-Voltage Detect (LVD) System
- 5.7 MCLK Output
- 5.8 Reset, Interrupt, and System Control Registers and Control Bits
- 5.8.1 Interrupt Pin Request Status and Control Register (IRQSC)
- 5.8.2 System Reset Status Register (SRS)
- 5.8.3 System Background Debug Force Reset Register (SBDFR)
- 5.8.4 System Options Register 1 (SOPT1)
- 5.8.5 System Options Register 2 (SOPT2)
- 5.8.6 System Device Identification Register (SDIDH, SDIDL)
- 5.8.7 System Power Management Status and Control 1 Register (SPMSC1)
- 5.8.8 System Power Management Status and Control 2 Register (SPMSC2)
- Chapter 6 Parallel Input/Output Control
- 6.1 Port Data and Data Direction
- 6.2 Pull-up, Slew Rate, and Drive Strength
- 6.3 Pin Interrupts
- 6.4 Pin Behavior in Stop Modes
- 6.5 Parallel I/O and Pin Control Registers
- 6.5.1 Port A Registers
- 6.5.1.1 Port A Data Register (PTAD)
- 6.5.1.2 Port A Data Direction Register (PTADD)
- 6.5.1.3 Port A Pull Enable Register (PTAPE)
- 6.5.1.4 Port A Slew Rate Enable Register (PTASE)
- 6.5.1.5 Port A Drive Strength Selection Register (PTADS)
- 6.5.1.6 Port A Interrupt Status and Control Register (PTASC)
- 6.5.1.7 Port A Interrupt Pin Select Register (PTAPS)
- 6.5.1.8 Port A Interrupt Edge Select Register (PTAES)
- 6.5.2 Port B Registers
- 6.5.2.1 Port B Data Register (PTBD)
- 6.5.2.2 Port B Data Direction Register (PTBDD)
- 6.5.2.3 Port B Pull Enable Register (PTBPE)
- 6.5.2.4 Port B Slew Rate Enable Register (PTBSE)
- 6.5.2.5 Port B Drive Strength Selection Register (PTBDS)
- 6.5.2.6 Port B Interrupt Status and Control Register (PTBSC)
- 6.5.2.7 Port B Interrupt Pin Select Register (PTBPS)
- 6.5.2.8 Port B Interrupt Edge Select Register (PTBES)
- 6.5.3 Port C Registers
- 6.5.4 Port D Registers
- 6.5.4.1 Port D Data Register (PTDD)
- 6.5.4.2 Port D Data Direction Register (PTDDD)
- 6.5.4.3 Port D Pull Enable Register (PTDPE)
- 6.5.4.4 Port D Slew Rate Enable Register (PTDSE)
- 6.5.4.5 Port D Drive Strength Selection Register (PTDDS)
- 6.5.4.6 Port D Interrupt Status and Control Register (PTDSC)
- 6.5.4.7 Port D Interrupt Pin Select Register (PTDPS)
- 6.5.4.8 Port D Interrupt Edge Select Register (PTDES)
- 6.5.5 Port E Registers
- 6.5.6 Port F Registers
- 6.5.7 Port G Registers
- 6.5.1 Port A Registers
- Chapter 7 Central Processor Unit (S08CPUV3)
- 7.1 Introduction
- 7.2 Programmer’s Model and CPU Registers
- 7.3 Addressing Modes
- 7.4 Special Operations
- 7.5 HCS08 Instruction Set Summary
- Chapter 8 Multi-Purpose Clock Generator (S08MCGV1)
- 8.1 Introduction
- 8.2 External Signal Description
- 8.3 Register Definition
- 8.4 Functional Description
- 8.4.1 Operational Modes
- 8.4.1.1 FLL Engaged Internal (FEI)
- 8.4.1.2 FLL Engaged External (FEE)
- 8.4.1.3 FLL Bypassed Internal (FBI)
- 8.4.1.4 FLL Bypassed External (FBE)
- 8.4.1.5 PLL Engaged External (PEE)
- 8.4.1.6 PLL Bypassed External (PBE)
- 8.4.1.7 Bypassed Low Power Internal (BLPI)
- 8.4.1.8 Bypassed Low Power External (BLPE)
- 8.4.1.9 Stop
- 8.4.2 Mode Switching
- 8.4.3 Bus Frequency Divider
- 8.4.4 Low Power Bit Usage
- 8.4.5 Internal Reference Clock
- 8.4.6 External Reference Clock
- 8.4.7 Fixed Frequency Clock
- 8.4.1 Operational Modes
- 8.5 Initialization / Application Information
- 8.5.1 MCG Module Initialization Sequence
- 8.5.2 MCG Mode Switching
- 8.5.2.1 Example # 1: Moving from FEI to PEE Mode: External Crystal = 4 MHz, Bus Frequency = 8 MHz
- 8.5.2.2 Example # 2: Moving from PEE to BLPI Mode: External Crystal = 4 MHz, Bus Frequency =16 kHz
- 8.5.2.3 Example #3: Moving from BLPI to FEE Mode: External Crystal = 4 MHz, Bus Frequency = 16 MHz
- 8.5.2.4 Example # 4: Moving from FEI to PEE Mode: External Crystal = 8 MHz, Bus Frequency = 8 MHz
- 8.5.3 Calibrating the Internal Reference Clock (IRC)
- Chapter 9 Analog Comparator (S08ACMPV3)
- Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
- 10.1 Introduction
- 10.2 External Signal Description
- 10.3 Register Definition
- 10.3.1 Status and Control Register 1 (ADCSC1)
- 10.3.2 Status and Control Register 2 (ADCSC2)
- 10.3.3 Data Result High Register (ADCRH)
- 10.3.4 Data Result Low Register (ADCRL)
- 10.3.5 Compare Value High Register (ADCCVH)
- 10.3.6 Compare Value Low Register (ADCCVL)
- 10.3.7 Configuration Register (ADCCFG)
- 10.3.8 Pin Control 1 Register (APCTL1)
- 10.3.9 Pin Control 2 Register (APCTL2)
- 10.3.10 Pin Control 3 Register (APCTL3)
- 10.4 Functional Description
- 10.5 Initialization Information
- 10.6 Application Information
- Chapter 11 Inter-Integrated Circuit (S08IICV2)
- Chapter 12 Serial Peripheral Interface (S08SPIV3)
- Chapter 13 Serial Communications Interface (S08SCIV4)
- Chapter 14 Real-Time Counter (S08RTCV1)
- Chapter 15 Timer Pulse-Width Modulator (S08TPMV3)
- Chapter 16 Development Support
- 16.1 Introduction
- 16.2 Background Debug Controller (BDC)
- 16.3 On-Chip Debug System (DBG)
- 16.4 Register Definition
- 16.4.1 BDC Registers and Control Bits
- 16.4.2 System Background Debug Force Reset Register (SBDFR)
- 16.4.3 DBG Registers and Control Bits
- 16.4.3.1 Debug Comparator A High Register (DBGCAH)
- 16.4.3.2 Debug Comparator A Low Register (DBGCAL)
- 16.4.3.3 Debug Comparator B High Register (DBGCBH)
- 16.4.3.4 Debug Comparator B Low Register (DBGCBL)
- 16.4.3.5 Debug FIFO High Register (DBGFH)
- 16.4.3.6 Debug FIFO Low Register (DBGFL)
- 16.4.3.7 Debug Control Register (DBGC)
- 16.4.3.8 Debug Trigger Register (DBGT)
- 16.4.3.9 Debug Status Register (DBGS)
- Appendix A Electrical Characteristics
- A.1 Introduction
- A.2 Parameter Classification
- A.3 Absolute Maximum Ratings
- A.4 Thermal Characteristics
- A.5 ESD Protection and Latch-Up Immunity
- A.6 DC Characteristics
- A.7 Supply Current Characteristics
- A.8 Analog Comparator (ACMP) Electricals
- A.9 ADC Characteristics
- A.10 External Oscillator (XOSC) Characteristics
- A.11 MCG Specifications
- A.12 AC Characteristics
- A.13 Flash and EEPROM
- A.14 EMC Performance
- Appendix B Timer Pulse-Width Modulator (TPMV2)
- Appendix C Ordering Information and Mechanical Drawings
Chapter 3 Modes of Operation
MC9S08DN60 Series Data Sheet, Rev 3
34 Freescale Semiconductor
3.6.1.2 Active BDM Enabled in Stop3 Mode
Entry into the active background mode from run mode is enabled if ENBDM in BDCSCR is set. This
register is described in Chapter 16, “Development Support.” If ENBDM is set when the CPU executes a
STOP instruction, the system clocks to the background debug logic remain active when the MCU enters
stop mode. Because of this, background debug communication remains possible. In addition, the voltage
regulator does not enter its low-power standby state but maintains full internal regulation.
Most background commands are not available in stop mode. The memory-access-with-status commands
do not allow memory access, but they report an error indicating that the MCU is in either stop or wait
mode. The BACKGROUND command can be used to wake the MCU from stop and enter active
background mode if the ENBDM bit is set. After entering background debug mode, all background
commands are available.
3.6.2 Stop2 Mode
Stop2 mode is entered by executing a STOP instruction under the conditions as shown in Table 3-1. Most
of the internal circuitry of the MCU is powered off in stop2 with the exception of the RAM. Upon entering
stop2, all I/O pin control signals are latched so that the pins retain their states during stop2.
Exit from stop2 is performed by asserting
RESET. On 3M05C or older masksets only, exit from stop2 can
also be performed by asserting PTA7/ADP7/IRQ.
NOTE
On 3M05C or older masksets only, PTA7/ADP7/IRQ is an active low
wake-up and must be configured as an input prior to executing a STOP
instruction to avoid an immediate exit from stop2. PTA7/ADP7/IRQ can be
disabled as a wake-up if it is configured as a high driven output. For lowest
power consumption in stop2, this pin should not be left open when
configured as input (enable the internal pullup; or tie an external
pullup/down device; or set pin as output).
In addition, the real-time counter (RTC) can wake the MCU from stop2, if enabled.
Upon wake-up from stop2 mode, the MCU starts up as from a power-on reset (POR):
• All module control and status registers are reset
• The LVD reset function is enabled and the MCU remains in the reset state if V
DD
is below the LVD
trip point (low trip point selected due to POR)
• The CPU takes the reset vector
In addition to the above, upon waking up from stop2, the PPDF bit in SPMSC2 is set. This flag is used to
direct user code to go to a stop2 recovery routine. PPDF remains set and the I/O pin states remain latched
until a 1 is written to PPDACK in SPMSC2.