Datasheet
Table Of Contents
- Chapter 1 Device Overview
- Chapter 2 Pins and Connections
- Chapter 3 Modes of Operation
- Chapter 4 Memory
- 4.1 MC9S08DN60 Series Memory Map
- 4.2 Reset and Interrupt Vector Assignments
- 4.3 Register Addresses and Bit Assignments
- 4.4 RAM
- 4.5 Flash and EEPROM
- 4.5.1 Features
- 4.5.2 Program and Erase Times
- 4.5.3 Program and Erase Command Execution
- 4.5.4 Burst Program Execution
- 4.5.5 Sector Erase Abort
- 4.5.6 Access Errors
- 4.5.7 Block Protection
- 4.5.8 Vector Redirection
- 4.5.9 Security
- 4.5.10 EEPROM Mapping
- 4.5.11 Flash and EEPROM Registers and Control Bits
- 4.5.11.1 Flash and EEPROM Clock Divider Register (FCDIV)
- 4.5.11.2 Flash and EEPROM Options Register (FOPT and NVOPT)
- 4.5.11.3 Flash and EEPROM Configuration Register (FCNFG)
- 4.5.11.4 Flash and EEPROM Protection Register (FPROT and NVPROT)
- 4.5.11.5 Flash and EEPROM Status Register (FSTAT)
- 4.5.11.6 Flash and EEPROM Command Register (FCMD)
- Chapter 5 Resets, Interrupts, and General System Control
- 5.1 Introduction
- 5.2 Features
- 5.3 MCU Reset
- 5.4 Computer Operating Properly (COP) Watchdog
- 5.5 Interrupts
- 5.6 Low-Voltage Detect (LVD) System
- 5.7 MCLK Output
- 5.8 Reset, Interrupt, and System Control Registers and Control Bits
- 5.8.1 Interrupt Pin Request Status and Control Register (IRQSC)
- 5.8.2 System Reset Status Register (SRS)
- 5.8.3 System Background Debug Force Reset Register (SBDFR)
- 5.8.4 System Options Register 1 (SOPT1)
- 5.8.5 System Options Register 2 (SOPT2)
- 5.8.6 System Device Identification Register (SDIDH, SDIDL)
- 5.8.7 System Power Management Status and Control 1 Register (SPMSC1)
- 5.8.8 System Power Management Status and Control 2 Register (SPMSC2)
- Chapter 6 Parallel Input/Output Control
- 6.1 Port Data and Data Direction
- 6.2 Pull-up, Slew Rate, and Drive Strength
- 6.3 Pin Interrupts
- 6.4 Pin Behavior in Stop Modes
- 6.5 Parallel I/O and Pin Control Registers
- 6.5.1 Port A Registers
- 6.5.1.1 Port A Data Register (PTAD)
- 6.5.1.2 Port A Data Direction Register (PTADD)
- 6.5.1.3 Port A Pull Enable Register (PTAPE)
- 6.5.1.4 Port A Slew Rate Enable Register (PTASE)
- 6.5.1.5 Port A Drive Strength Selection Register (PTADS)
- 6.5.1.6 Port A Interrupt Status and Control Register (PTASC)
- 6.5.1.7 Port A Interrupt Pin Select Register (PTAPS)
- 6.5.1.8 Port A Interrupt Edge Select Register (PTAES)
- 6.5.2 Port B Registers
- 6.5.2.1 Port B Data Register (PTBD)
- 6.5.2.2 Port B Data Direction Register (PTBDD)
- 6.5.2.3 Port B Pull Enable Register (PTBPE)
- 6.5.2.4 Port B Slew Rate Enable Register (PTBSE)
- 6.5.2.5 Port B Drive Strength Selection Register (PTBDS)
- 6.5.2.6 Port B Interrupt Status and Control Register (PTBSC)
- 6.5.2.7 Port B Interrupt Pin Select Register (PTBPS)
- 6.5.2.8 Port B Interrupt Edge Select Register (PTBES)
- 6.5.3 Port C Registers
- 6.5.4 Port D Registers
- 6.5.4.1 Port D Data Register (PTDD)
- 6.5.4.2 Port D Data Direction Register (PTDDD)
- 6.5.4.3 Port D Pull Enable Register (PTDPE)
- 6.5.4.4 Port D Slew Rate Enable Register (PTDSE)
- 6.5.4.5 Port D Drive Strength Selection Register (PTDDS)
- 6.5.4.6 Port D Interrupt Status and Control Register (PTDSC)
- 6.5.4.7 Port D Interrupt Pin Select Register (PTDPS)
- 6.5.4.8 Port D Interrupt Edge Select Register (PTDES)
- 6.5.5 Port E Registers
- 6.5.6 Port F Registers
- 6.5.7 Port G Registers
- 6.5.1 Port A Registers
- Chapter 7 Central Processor Unit (S08CPUV3)
- 7.1 Introduction
- 7.2 Programmer’s Model and CPU Registers
- 7.3 Addressing Modes
- 7.4 Special Operations
- 7.5 HCS08 Instruction Set Summary
- Chapter 8 Multi-Purpose Clock Generator (S08MCGV1)
- 8.1 Introduction
- 8.2 External Signal Description
- 8.3 Register Definition
- 8.4 Functional Description
- 8.4.1 Operational Modes
- 8.4.1.1 FLL Engaged Internal (FEI)
- 8.4.1.2 FLL Engaged External (FEE)
- 8.4.1.3 FLL Bypassed Internal (FBI)
- 8.4.1.4 FLL Bypassed External (FBE)
- 8.4.1.5 PLL Engaged External (PEE)
- 8.4.1.6 PLL Bypassed External (PBE)
- 8.4.1.7 Bypassed Low Power Internal (BLPI)
- 8.4.1.8 Bypassed Low Power External (BLPE)
- 8.4.1.9 Stop
- 8.4.2 Mode Switching
- 8.4.3 Bus Frequency Divider
- 8.4.4 Low Power Bit Usage
- 8.4.5 Internal Reference Clock
- 8.4.6 External Reference Clock
- 8.4.7 Fixed Frequency Clock
- 8.4.1 Operational Modes
- 8.5 Initialization / Application Information
- 8.5.1 MCG Module Initialization Sequence
- 8.5.2 MCG Mode Switching
- 8.5.2.1 Example # 1: Moving from FEI to PEE Mode: External Crystal = 4 MHz, Bus Frequency = 8 MHz
- 8.5.2.2 Example # 2: Moving from PEE to BLPI Mode: External Crystal = 4 MHz, Bus Frequency =16 kHz
- 8.5.2.3 Example #3: Moving from BLPI to FEE Mode: External Crystal = 4 MHz, Bus Frequency = 16 MHz
- 8.5.2.4 Example # 4: Moving from FEI to PEE Mode: External Crystal = 8 MHz, Bus Frequency = 8 MHz
- 8.5.3 Calibrating the Internal Reference Clock (IRC)
- Chapter 9 Analog Comparator (S08ACMPV3)
- Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
- 10.1 Introduction
- 10.2 External Signal Description
- 10.3 Register Definition
- 10.3.1 Status and Control Register 1 (ADCSC1)
- 10.3.2 Status and Control Register 2 (ADCSC2)
- 10.3.3 Data Result High Register (ADCRH)
- 10.3.4 Data Result Low Register (ADCRL)
- 10.3.5 Compare Value High Register (ADCCVH)
- 10.3.6 Compare Value Low Register (ADCCVL)
- 10.3.7 Configuration Register (ADCCFG)
- 10.3.8 Pin Control 1 Register (APCTL1)
- 10.3.9 Pin Control 2 Register (APCTL2)
- 10.3.10 Pin Control 3 Register (APCTL3)
- 10.4 Functional Description
- 10.5 Initialization Information
- 10.6 Application Information
- Chapter 11 Inter-Integrated Circuit (S08IICV2)
- Chapter 12 Serial Peripheral Interface (S08SPIV3)
- Chapter 13 Serial Communications Interface (S08SCIV4)
- Chapter 14 Real-Time Counter (S08RTCV1)
- Chapter 15 Timer Pulse-Width Modulator (S08TPMV3)
- Chapter 16 Development Support
- 16.1 Introduction
- 16.2 Background Debug Controller (BDC)
- 16.3 On-Chip Debug System (DBG)
- 16.4 Register Definition
- 16.4.1 BDC Registers and Control Bits
- 16.4.2 System Background Debug Force Reset Register (SBDFR)
- 16.4.3 DBG Registers and Control Bits
- 16.4.3.1 Debug Comparator A High Register (DBGCAH)
- 16.4.3.2 Debug Comparator A Low Register (DBGCAL)
- 16.4.3.3 Debug Comparator B High Register (DBGCBH)
- 16.4.3.4 Debug Comparator B Low Register (DBGCBL)
- 16.4.3.5 Debug FIFO High Register (DBGFH)
- 16.4.3.6 Debug FIFO Low Register (DBGFL)
- 16.4.3.7 Debug Control Register (DBGC)
- 16.4.3.8 Debug Trigger Register (DBGT)
- 16.4.3.9 Debug Status Register (DBGS)
- Appendix A Electrical Characteristics
- A.1 Introduction
- A.2 Parameter Classification
- A.3 Absolute Maximum Ratings
- A.4 Thermal Characteristics
- A.5 ESD Protection and Latch-Up Immunity
- A.6 DC Characteristics
- A.7 Supply Current Characteristics
- A.8 Analog Comparator (ACMP) Electricals
- A.9 ADC Characteristics
- A.10 External Oscillator (XOSC) Characteristics
- A.11 MCG Specifications
- A.12 AC Characteristics
- A.13 Flash and EEPROM
- A.14 EMC Performance
- Appendix B Timer Pulse-Width Modulator (TPMV2)
- Appendix C Ordering Information and Mechanical Drawings

Chapter 8 Multi-Purpose Clock Generator (S08MCGV1)
MC9S08DN60 Series Data Sheet, Rev 3
144 Freescale Semiconductor
• LP bit is written to 1
• BDM mode is not active
In bypassed low power external mode, the MCGOUT clock is derived from the external reference clock.
The external reference clock which is enabled can be an external crystal/resonator or it can be another
external clock source.
The PLL and the FLL are disabled at all times in BLPE mode and the MCGLCLK will not be available
for BDC communications. If the BDM becomes active the mode will switch to one of the bypassed
external modes as determined by the state of the PLLS bit.
8.4.1.9 Stop
Stop mode is entered whenever the MCU enters a STOP state. In this mode, the FLL and PLL are disabled
and all MCG clock signals are static except in the following cases:
MCGIRCLK will be active in stop mode when all the following conditions occur:
• IRCLKEN = 1
• IREFSTEN = 1
MCGERCLK will be active in stop mode when all the following conditions occur:
• ERCLKEN = 1
• EREFSTEN = 1
8.4.2 Mode Switching
When switching between engaged internal and engaged external modes the IREFS bit can be changed at
anytime, but the RDIV bits must be changed simultaneously so that the reference frequency stays in the
range required by the state of the PLLS bit (31.25 kHz to 39.0625 kHz if the FLL is selected, or 1 MHz to
2 MHz if the PLL is selected). After a change in the IREFS value the FLL or PLL will begin locking again
after the switch is completed. The completion of the switch is shown by the IREFST bit .
For the special case of entering stop mode immediately after switching to FBE mode, if the external clock
and the internal clock are disabled in stop mode, (EREFSTEN = 0 and IREFSTEN = 0), it is necessary to
allow 100us after the IREFST bit is cleared to allow the internal reference to shutdown. For most cases the
delay due to instruction execution times will be sufficient.
The CLKS bits can also be changed at anytime, but in order for the MCGLCLK to be configured correctly
the RDIV bits must be changed simultaneously so that the reference frequency stays in the range required
by the state of the PLLS bit (31.25 kHz to 39.0625 kHz if the FLL is selected, or 1 MHz to 2MHz if the
PLL is selected). The actual switch to the newly selected clock will be shown by the CLKST bits. If the
newly selected clock is not available, the previous clock will remain selected.
For details see Figure 8-8.