Datasheet

Mechanical Specifications
MC68HC908AP Family Data Sheet, Rev. 4
318 Freescale Semiconductor
23.4 42-Pin Shrink Dual In-Line Package (SDIP)
Figure 23-3. 42-Pin SDIP (Case #858)
–A–
42 22
121
–B–
SEATING
PLANE
–T–
S
A
M
0.25 (0.010) T
S
B
M
0.25 (0.010) T
L
H
M
J
42 PL
D 42 PL
F
G
N
K
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 1.435 1.465 36.45 37.21
B 0.540 0.560 13.72 14.22
C 0.155 0.200 3.94 5.08
D 0.014 0.022 0.36 0.56
F 0.032 0.046 0.81 1.17
G 0.070 BSC 1.778 BSC
H 0.300 BSC 7.62 BSC
J 0.008 0.015 0.20 0.38
K 0.115 0.135 2.92 3.43
L 0.600 BSC 15.24 BSC
M 0° 15° 0 ° 15°
N 0.020 0.040 0.51 1.02