Datasheet
Table Of Contents
- List of Sections
- Table of Contents
- List of Figures
- List of Tables
- Section 1. General Description
- 1.1 Contents
- 1.2 Introduction
- 1.3 Features
- 1.4 MCU Block Diagram
- 1.5 Pin Assignments
- 1.6 Pin Functions
- 1.6.1 Power Supply Pins (Vdd and Vss)
- 1.6.2 Oscillator Pins (OSC1 and OSC2)
- 1.6.3 External Reset Pin (RST)
- 1.6.4 External Interrupt Pin (IRQ)
- 1.6.5 Analog Power Supply Pin (VDDA)
- 1.6.6 Analog Ground Pin (VSSA)
- 1.6.7 Analog Ground Pin (AVSS/VREFL)
- 1.6.8 ADC Voltage Reference Pin (VREFH)
- 1.6.9 Analog Supply Pin (VDDAREF)
- 1.6.10 External Filter Capacitor Pin (CGMXFC)
- 1.6.11 Port A Input/Output (I/O) Pins (PTA7-PTA0)
- 1.6.12 Port B I/O Pins (PTB7/ATD7-PTB0/ATD0)
- 1.6.13 Port C I/O Pins (PTC5-PTC0)
- 1.6.14 Port D I/O Pins (PTD7-PTD0)
- 1.6.15 Port E I/O Pins (PTE7/SPSCK-PTE0/TxD)
- 1.6.16 Port F I/O Pins (PTF7-PTF0/TACH2)
- 1.6.17 Port G I/O Pins (PTG2/KBD2-PTG0/KBD0)
- 1.6.18 Port H I/O Pins (PTH1/KBD4-PTH0/KBD3)
- 1.7 I/O Pin Summary
- 1.8 Signal Name Conventions
- 1.9 Clock Source Summary
- Section 2. Memory Map
- Section 3. Random-Access Memory (RAM)
- Section 4. FLASH Memory
- Section 5. EEPROM
- Section 6. Configuration Register (CONFIG)
- Section 7. Central Processor Unit (CPU)
- Section 8. System Integration Module (SIM)
- Section 9. Clock Generator Module (CGM)
- 9.1 Contents
- 9.2 Introduction
- 9.3 Features
- 9.4 Functional Description
- 9.5 I/O Signals
- 9.5.1 Crystal Amplifier Input Pin (OSC1)
- 9.5.2 Crystal Amplifier Output Pin (OSC2)
- 9.5.3 External Filter Capacitor Pin (CGMXFC)
- 9.5.4 PLL Analog Power Pin (VDDA)
- 9.5.5 Oscillator Enable Signal (SIMOSCEN)
- 9.5.6 Crystal Output Frequency Signal (CGMXCLK)
- 9.5.7 CGM Base Clock Output (CGMOUT)
- 9.5.8 CGM CPU Interrupt (CGMINT)
- 9.6 CGM Registers
- 9.7 Interrupts
- 9.8 Low-Power Modes
- 9.9 CGM During Break Interrupts
- 9.10 Acquisition/Lock Time Specifications
- Section 10. Monitor ROM (MON)
- Section 11. Timer Interface Module A (TIMA)
- Section 12. Timer Interface Module B (TIMB)
- Section 13. Programmable Interrupt Timer (PIT)
- Section 14. Analog-to-Digital Converter (ADC)
- Section 15. Serial Communications Interface Module (SCI)
- Section 16. Serial Peripheral Interface Module (SPI)
- 16.1 Contents
- 16.2 Introduction
- 16.3 Features
- 16.4 Pin Name Conventions and I/O Register Addresses
- 16.5 Functional Description
- 16.6 Transmission Formats
- 16.7 Queuing Transmission Data
- 16.8 Error Conditions
- 16.9 Interrupts
- 16.10 Resetting the SPI
- 16.11 Low-Power Modes
- 16.12 SPI During Break Interrupts
- 16.13 I/O Signals
- 16.14 I/O Registers
- Section 17. Input/Output (I/O) Ports
- Section 18. External Interrupt (IRQ)
- Section 19. Keyboard Interrupt Module (KBI)
- Section 20. Computer Operating Properly (COP)
- Section 21. Low-Voltage Inhibit (LVI)
- Section 22. Break Module (BRK)
- Section 23. Electrical Specifications
- 23.1 Contents
- 23.2 Introduction
- 23.3 Absolute Maximum Ratings
- 23.4 Functional Operating Range
- 23.5 Thermal Characteristics
- 23.6 5.0-V DC Electrical Characteristics
- 23.7 EEPROM and Memory Characteristics
- 23.8 5.0-V Control Timing
- 23.9 Timer Interface Module Characteristics
- 23.10 ADC Characteristics
- 23.11 SPI Characteristics
- 23.12 Clock Generation Module Characteristics
- 23.13 FLASH Memory Characteristics
- Section 24. Mechanical Specifications
- Section 25. Ordering Information
FLASH Memory
Technical Data MC68HC908AB32 — Rev. 1.1
64 FLASH Memory Freescale Semiconductor
NOTE: Programming and erasing of FLASH locations cannot be performed by
code being executed from the FLASH memory. While these operations
must be performed in the order shown, other unrelated operations may
occur between the steps. Do not exceed t
PROG
maximum. See 23.13
FLASH Memory Characteristics.
4.8 FLASH Block Protection
Due to the ability of the on-board charge pump to erase and program the
FLASH memory in the target application, provision is made for protecting
a block of memory from unintentional erase or program operations due
to system malfunction. This protection is done by using of a FLASH
Block Protect Register (FLBPR). The FLBPR determines the range of
the FLASH memory which is to be protected. The range of the protected
area starts from a location defined by FLBPR and ends at the bottom of
the FLASH memory ($FFFF). When the memory is protected, the HVEN
bit cannot be set in either ERASE or PROGRAM operations.
NOTE: In performing a program or erase operation, the FLASH block protect
register must be read after setting the PGM or ERASE bit and before
asserting the HVEN bit
When the FLBPR is program with all 0’s, the entire memory is protected
from being programmed and erased. When all the bits are erased (all
1’s), the entire memory is accessible for program and erase.
When bits within the FLBPR are programmed, they lock a block of
memory, address ranges as shown in 4.8.1 FLASH Block Protect
Register. Once the FLBPR is programmed with a value other than $FF,
any erase or program of the FLBPR or the protected block of FLASH
memory is prohibited. The FLBPR itself can be erased or programmed
only with an external voltage, V
TST
, present on the IRQ pin. This voltage
also allows entry from reset into the monitor mode.
