Datasheet
Table Of Contents
- List of Sections
- Table of Contents
- List of Figures
- List of Tables
- Section 1. General Description
- 1.1 Contents
- 1.2 Introduction
- 1.3 Features
- 1.4 MCU Block Diagram
- 1.5 Pin Assignments
- 1.6 Pin Functions
- 1.6.1 Power Supply Pins (Vdd and Vss)
- 1.6.2 Oscillator Pins (OSC1 and OSC2)
- 1.6.3 External Reset Pin (RST)
- 1.6.4 External Interrupt Pin (IRQ)
- 1.6.5 Analog Power Supply Pin (VDDA)
- 1.6.6 Analog Ground Pin (VSSA)
- 1.6.7 Analog Ground Pin (AVSS/VREFL)
- 1.6.8 ADC Voltage Reference Pin (VREFH)
- 1.6.9 Analog Supply Pin (VDDAREF)
- 1.6.10 External Filter Capacitor Pin (CGMXFC)
- 1.6.11 Port A Input/Output (I/O) Pins (PTA7-PTA0)
- 1.6.12 Port B I/O Pins (PTB7/ATD7-PTB0/ATD0)
- 1.6.13 Port C I/O Pins (PTC5-PTC0)
- 1.6.14 Port D I/O Pins (PTD7-PTD0)
- 1.6.15 Port E I/O Pins (PTE7/SPSCK-PTE0/TxD)
- 1.6.16 Port F I/O Pins (PTF7-PTF0/TACH2)
- 1.6.17 Port G I/O Pins (PTG2/KBD2-PTG0/KBD0)
- 1.6.18 Port H I/O Pins (PTH1/KBD4-PTH0/KBD3)
- 1.7 I/O Pin Summary
- 1.8 Signal Name Conventions
- 1.9 Clock Source Summary
- Section 2. Memory Map
- Section 3. Random-Access Memory (RAM)
- Section 4. FLASH Memory
- Section 5. EEPROM
- Section 6. Configuration Register (CONFIG)
- Section 7. Central Processor Unit (CPU)
- Section 8. System Integration Module (SIM)
- Section 9. Clock Generator Module (CGM)
- 9.1 Contents
- 9.2 Introduction
- 9.3 Features
- 9.4 Functional Description
- 9.5 I/O Signals
- 9.5.1 Crystal Amplifier Input Pin (OSC1)
- 9.5.2 Crystal Amplifier Output Pin (OSC2)
- 9.5.3 External Filter Capacitor Pin (CGMXFC)
- 9.5.4 PLL Analog Power Pin (VDDA)
- 9.5.5 Oscillator Enable Signal (SIMOSCEN)
- 9.5.6 Crystal Output Frequency Signal (CGMXCLK)
- 9.5.7 CGM Base Clock Output (CGMOUT)
- 9.5.8 CGM CPU Interrupt (CGMINT)
- 9.6 CGM Registers
- 9.7 Interrupts
- 9.8 Low-Power Modes
- 9.9 CGM During Break Interrupts
- 9.10 Acquisition/Lock Time Specifications
- Section 10. Monitor ROM (MON)
- Section 11. Timer Interface Module A (TIMA)
- Section 12. Timer Interface Module B (TIMB)
- Section 13. Programmable Interrupt Timer (PIT)
- Section 14. Analog-to-Digital Converter (ADC)
- Section 15. Serial Communications Interface Module (SCI)
- Section 16. Serial Peripheral Interface Module (SPI)
- 16.1 Contents
- 16.2 Introduction
- 16.3 Features
- 16.4 Pin Name Conventions and I/O Register Addresses
- 16.5 Functional Description
- 16.6 Transmission Formats
- 16.7 Queuing Transmission Data
- 16.8 Error Conditions
- 16.9 Interrupts
- 16.10 Resetting the SPI
- 16.11 Low-Power Modes
- 16.12 SPI During Break Interrupts
- 16.13 I/O Signals
- 16.14 I/O Registers
- Section 17. Input/Output (I/O) Ports
- Section 18. External Interrupt (IRQ)
- Section 19. Keyboard Interrupt Module (KBI)
- Section 20. Computer Operating Properly (COP)
- Section 21. Low-Voltage Inhibit (LVI)
- Section 22. Break Module (BRK)
- Section 23. Electrical Specifications
- 23.1 Contents
- 23.2 Introduction
- 23.3 Absolute Maximum Ratings
- 23.4 Functional Operating Range
- 23.5 Thermal Characteristics
- 23.6 5.0-V DC Electrical Characteristics
- 23.7 EEPROM and Memory Characteristics
- 23.8 5.0-V Control Timing
- 23.9 Timer Interface Module Characteristics
- 23.10 ADC Characteristics
- 23.11 SPI Characteristics
- 23.12 Clock Generation Module Characteristics
- 23.13 FLASH Memory Characteristics
- Section 24. Mechanical Specifications
- Section 25. Ordering Information
FLASH Memory
Technical Data MC68HC908AB32 — Rev. 1.1
62 FLASH Memory Freescale Semiconductor
9. Clear the HVEN bit.
10. After a time, t
rcv
(typ. 1µs), the memory can be accessed again in
read mode.
NOTE: While these operations must be performed in the order shown, other
unrelated operations may occur between the steps.
4.6 FLASH Mass Erase Operation
Use this step-by-step procedure to erase entire FLASH memory to read
as logic 1:
1. Set both the ERASE bit, and the MASS bit in the FLASH control
register.
2. Read from the FLASH block protect register.
3. Write any data to any FLASH address* within the FLASH memory
address range.
4. Wait for a time, t
nvs
(min. 10µs)
5. Set the HVEN bit.
6. Wait for a time, t
MErase
(min. 4ms)
7. Clear the ERASE bit.
8. Wait for a time, t
nvhl
(min. 100µs)
9. Clear the HVEN bit.
10. After a time, t
rcv
(min. 1µs), the memory can be accessed again in
read mode.
* When in Monitor mode, with security sequence failed (see 10.5 Security), write to the FLASH
block protect register instead of any FLASH address.
NOTE: Programming and erasing of FLASH locations cannot be performed by
code being executed from the FLASH memory. While these operations
must be performed in the order shown, other unrelated operations may
occur between the steps.
