Datasheet
Table Of Contents
- List of Sections
- Table of Contents
- List of Figures
- List of Tables
- Section 1. General Description
- 1.1 Contents
- 1.2 Introduction
- 1.3 Features
- 1.4 MCU Block Diagram
- 1.5 Pin Assignments
- 1.6 Pin Functions
- 1.6.1 Power Supply Pins (Vdd and Vss)
- 1.6.2 Oscillator Pins (OSC1 and OSC2)
- 1.6.3 External Reset Pin (RST)
- 1.6.4 External Interrupt Pin (IRQ)
- 1.6.5 Analog Power Supply Pin (VDDA)
- 1.6.6 Analog Ground Pin (VSSA)
- 1.6.7 Analog Ground Pin (AVSS/VREFL)
- 1.6.8 ADC Voltage Reference Pin (VREFH)
- 1.6.9 Analog Supply Pin (VDDAREF)
- 1.6.10 External Filter Capacitor Pin (CGMXFC)
- 1.6.11 Port A Input/Output (I/O) Pins (PTA7-PTA0)
- 1.6.12 Port B I/O Pins (PTB7/ATD7-PTB0/ATD0)
- 1.6.13 Port C I/O Pins (PTC5-PTC0)
- 1.6.14 Port D I/O Pins (PTD7-PTD0)
- 1.6.15 Port E I/O Pins (PTE7/SPSCK-PTE0/TxD)
- 1.6.16 Port F I/O Pins (PTF7-PTF0/TACH2)
- 1.6.17 Port G I/O Pins (PTG2/KBD2-PTG0/KBD0)
- 1.6.18 Port H I/O Pins (PTH1/KBD4-PTH0/KBD3)
- 1.7 I/O Pin Summary
- 1.8 Signal Name Conventions
- 1.9 Clock Source Summary
- Section 2. Memory Map
- Section 3. Random-Access Memory (RAM)
- Section 4. FLASH Memory
- Section 5. EEPROM
- Section 6. Configuration Register (CONFIG)
- Section 7. Central Processor Unit (CPU)
- Section 8. System Integration Module (SIM)
- Section 9. Clock Generator Module (CGM)
- 9.1 Contents
- 9.2 Introduction
- 9.3 Features
- 9.4 Functional Description
- 9.5 I/O Signals
- 9.5.1 Crystal Amplifier Input Pin (OSC1)
- 9.5.2 Crystal Amplifier Output Pin (OSC2)
- 9.5.3 External Filter Capacitor Pin (CGMXFC)
- 9.5.4 PLL Analog Power Pin (VDDA)
- 9.5.5 Oscillator Enable Signal (SIMOSCEN)
- 9.5.6 Crystal Output Frequency Signal (CGMXCLK)
- 9.5.7 CGM Base Clock Output (CGMOUT)
- 9.5.8 CGM CPU Interrupt (CGMINT)
- 9.6 CGM Registers
- 9.7 Interrupts
- 9.8 Low-Power Modes
- 9.9 CGM During Break Interrupts
- 9.10 Acquisition/Lock Time Specifications
- Section 10. Monitor ROM (MON)
- Section 11. Timer Interface Module A (TIMA)
- Section 12. Timer Interface Module B (TIMB)
- Section 13. Programmable Interrupt Timer (PIT)
- Section 14. Analog-to-Digital Converter (ADC)
- Section 15. Serial Communications Interface Module (SCI)
- Section 16. Serial Peripheral Interface Module (SPI)
- 16.1 Contents
- 16.2 Introduction
- 16.3 Features
- 16.4 Pin Name Conventions and I/O Register Addresses
- 16.5 Functional Description
- 16.6 Transmission Formats
- 16.7 Queuing Transmission Data
- 16.8 Error Conditions
- 16.9 Interrupts
- 16.10 Resetting the SPI
- 16.11 Low-Power Modes
- 16.12 SPI During Break Interrupts
- 16.13 I/O Signals
- 16.14 I/O Registers
- Section 17. Input/Output (I/O) Ports
- Section 18. External Interrupt (IRQ)
- Section 19. Keyboard Interrupt Module (KBI)
- Section 20. Computer Operating Properly (COP)
- Section 21. Low-Voltage Inhibit (LVI)
- Section 22. Break Module (BRK)
- Section 23. Electrical Specifications
- 23.1 Contents
- 23.2 Introduction
- 23.3 Absolute Maximum Ratings
- 23.4 Functional Operating Range
- 23.5 Thermal Characteristics
- 23.6 5.0-V DC Electrical Characteristics
- 23.7 EEPROM and Memory Characteristics
- 23.8 5.0-V Control Timing
- 23.9 Timer Interface Module Characteristics
- 23.10 ADC Characteristics
- 23.11 SPI Characteristics
- 23.12 Clock Generation Module Characteristics
- 23.13 FLASH Memory Characteristics
- Section 24. Mechanical Specifications
- Section 25. Ordering Information
FLASH Memory
Technical Data MC68HC908AB32 — Rev. 1.1
60 FLASH Memory Freescale Semiconductor
page. Hence the minimum erase page size is 128 bytes. Program and
erase operations are facilitated through control bits in the FLASH Control
Register (FLCR). Details for these operations appear later in this
section. The address ranges for the user memory and vectors are:
• $8000–$FDFF; user memory.
• $FF7E; FLASH block protect register.
• $FE08; FLASH control register.
• $FFDC–$FFFF; these locations are reserved for user-defined
interrupt and reset vectors.
Programming tools are available from Freescale. Contact your local
Freescale representative for more information.
NOTE: A security feature prevents viewing of the FLASH contents.
1
4.4 FLASH Control Register
The FLASH control register (FLCR) controls FLASH program and erase
operations.
HVEN — High-Voltage Enable Bit
This read/write bit enables the charge pump to drive high voltages for
program and erase operations in the array. HVEN can only be set if
either PGM = 1 or ERASE = 1 and the proper sequence for program
or erase is followed.
1 = High voltage enabled to array and charge pump on
0 = High voltage disabled to array and charge pump off
1. No security feature is absolutely secure. However, Freescale’s strategy is to make reading or
copying the FLASH difficult for unauthorized users.
Address: $FE08
Bit 7654321Bit 0
Read: 0000
HVEN MASS ERASE PGM
Write:
Reset:00000000
Figure 4-1. FLASH Control Register (FLCR)
