Datasheet

Mechanical Specifications
Technical Data MC68HC908AB32 — Rev. 1.1
388 Mechanical Specifications Freescale Semiconductor
24.3 64-Pin Plastic Quad Flat Pack (QFP)
Figure 24-1. 64-Pin Plastic Quad Flat Pack (QFP)
L
L
–A–
–B–
DETAIL A
–D–
B
A
S
V
DETAIL A
P
B
B
D
–A–, –B–, –D–
C
–C–
E
H
G
M
M
DETAILC
SEATING
PLANE
DATUM
PLANE
1
16
–H–
0.01 (0.004)
R
DETAIL C
DATUM
PLANE
–H–
T
U
Q
K
W
X
S
A–B
M
0.20 (0.008) D
S
H
S
A–B
M
0.20 (0.008) D
S
C
0.05 (0.002)
A–B
S
A–B
M
0.20 (0.008) D
S
C
0.05 (0.002)
A–B
S
A–B
M
0.20 (0.008) D
S
H
48 33
S
A–B
M
0.02 (0.008) D
S
C
N
F
J
BASE
METAL
3249
1764
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 13.90 14.10 0.547 0.555
B 13.90 14.10 0.547 0.555
C 2.15 2.45 0.085 0.096
D 0.30 0.45 0.012 0.018
E 2.00 2.40 0.079 0.094
F 0.30 0.40 0.012 0.016
G 0.80 BSC 0.031 BSC
H — 0.25 — 0.010
J 0.13 0.23 0.005 0.009
K 0.65 0.95 0.026 0.037
L 12.00 REF 0.472 REF
M 5° 10° 5 ° 10°
N 0.13 0.17 0.005 0.007
P 0.40 BSC 0.016 BSC
Q 0° 7° 0° 7°
R 0.13 0.30 0.005 0.012
S 16.95 17.45 0.667 0.687
T 0.13 — 0.005 —
U 0° —0° —
V 16.95 17.45 0.667 0.687
W 0.35 0.45 0.014 0.018
X 1.6 REF 0.063 REF
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) PER SIDE.
TOTAL IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION. DAMBAR
CANNOT BE LOCATED ON THE LOWER RADIUS
OR THE FOOT.
SECTION B–B