Datasheet
Table Of Contents
- List of Sections
- Table of Contents
- List of Figures
- List of Tables
- Section 1. General Description
- 1.1 Contents
- 1.2 Introduction
- 1.3 Features
- 1.4 MCU Block Diagram
- 1.5 Pin Assignments
- 1.6 Pin Functions
- 1.6.1 Power Supply Pins (Vdd and Vss)
- 1.6.2 Oscillator Pins (OSC1 and OSC2)
- 1.6.3 External Reset Pin (RST)
- 1.6.4 External Interrupt Pin (IRQ)
- 1.6.5 Analog Power Supply Pin (VDDA)
- 1.6.6 Analog Ground Pin (VSSA)
- 1.6.7 Analog Ground Pin (AVSS/VREFL)
- 1.6.8 ADC Voltage Reference Pin (VREFH)
- 1.6.9 Analog Supply Pin (VDDAREF)
- 1.6.10 External Filter Capacitor Pin (CGMXFC)
- 1.6.11 Port A Input/Output (I/O) Pins (PTA7-PTA0)
- 1.6.12 Port B I/O Pins (PTB7/ATD7-PTB0/ATD0)
- 1.6.13 Port C I/O Pins (PTC5-PTC0)
- 1.6.14 Port D I/O Pins (PTD7-PTD0)
- 1.6.15 Port E I/O Pins (PTE7/SPSCK-PTE0/TxD)
- 1.6.16 Port F I/O Pins (PTF7-PTF0/TACH2)
- 1.6.17 Port G I/O Pins (PTG2/KBD2-PTG0/KBD0)
- 1.6.18 Port H I/O Pins (PTH1/KBD4-PTH0/KBD3)
- 1.7 I/O Pin Summary
- 1.8 Signal Name Conventions
- 1.9 Clock Source Summary
- Section 2. Memory Map
- Section 3. Random-Access Memory (RAM)
- Section 4. FLASH Memory
- Section 5. EEPROM
- Section 6. Configuration Register (CONFIG)
- Section 7. Central Processor Unit (CPU)
- Section 8. System Integration Module (SIM)
- Section 9. Clock Generator Module (CGM)
- 9.1 Contents
- 9.2 Introduction
- 9.3 Features
- 9.4 Functional Description
- 9.5 I/O Signals
- 9.5.1 Crystal Amplifier Input Pin (OSC1)
- 9.5.2 Crystal Amplifier Output Pin (OSC2)
- 9.5.3 External Filter Capacitor Pin (CGMXFC)
- 9.5.4 PLL Analog Power Pin (VDDA)
- 9.5.5 Oscillator Enable Signal (SIMOSCEN)
- 9.5.6 Crystal Output Frequency Signal (CGMXCLK)
- 9.5.7 CGM Base Clock Output (CGMOUT)
- 9.5.8 CGM CPU Interrupt (CGMINT)
- 9.6 CGM Registers
- 9.7 Interrupts
- 9.8 Low-Power Modes
- 9.9 CGM During Break Interrupts
- 9.10 Acquisition/Lock Time Specifications
- Section 10. Monitor ROM (MON)
- Section 11. Timer Interface Module A (TIMA)
- Section 12. Timer Interface Module B (TIMB)
- Section 13. Programmable Interrupt Timer (PIT)
- Section 14. Analog-to-Digital Converter (ADC)
- Section 15. Serial Communications Interface Module (SCI)
- Section 16. Serial Peripheral Interface Module (SPI)
- 16.1 Contents
- 16.2 Introduction
- 16.3 Features
- 16.4 Pin Name Conventions and I/O Register Addresses
- 16.5 Functional Description
- 16.6 Transmission Formats
- 16.7 Queuing Transmission Data
- 16.8 Error Conditions
- 16.9 Interrupts
- 16.10 Resetting the SPI
- 16.11 Low-Power Modes
- 16.12 SPI During Break Interrupts
- 16.13 I/O Signals
- 16.14 I/O Registers
- Section 17. Input/Output (I/O) Ports
- Section 18. External Interrupt (IRQ)
- Section 19. Keyboard Interrupt Module (KBI)
- Section 20. Computer Operating Properly (COP)
- Section 21. Low-Voltage Inhibit (LVI)
- Section 22. Break Module (BRK)
- Section 23. Electrical Specifications
- 23.1 Contents
- 23.2 Introduction
- 23.3 Absolute Maximum Ratings
- 23.4 Functional Operating Range
- 23.5 Thermal Characteristics
- 23.6 5.0-V DC Electrical Characteristics
- 23.7 EEPROM and Memory Characteristics
- 23.8 5.0-V Control Timing
- 23.9 Timer Interface Module Characteristics
- 23.10 ADC Characteristics
- 23.11 SPI Characteristics
- 23.12 Clock Generation Module Characteristics
- 23.13 FLASH Memory Characteristics
- Section 24. Mechanical Specifications
- Section 25. Ordering Information
Clock Generator Module (CGM)
MC68HC908AB32 — Rev. 1.1 Technical Data
Freescale Semiconductor Clock Generator Module (CGM)
153
• Lock time, t
LOCK
, is the time the PLL takes to reduce the error
between the actual output frequency and the desired output
frequency to less than the lock mode entry tolerance ∆
LOCK
. Lock
time is based on an initial frequency error, (f
DES
– f
ORIG
)/f
DES
, of
not more than ±100%. In automatic bandwidth control mode, lock
time expires when the LOCK bit becomes set in the PLL
bandwidth control register (PBWC). See 9.4.2.3 Manual and
Automatic PLL Bandwidth Modes.
Obviously, the acquisition and lock times can vary according to how
large the frequency error is and may be shorter or longer in many cases.
9.10.2 Parametric Influences On Reaction Time
Acquisition and lock times are designed to be as short as possible while
still providing the highest possible stability. These reaction times are not
constant, however. Many factors directly and indirectly affect the
acquisition time.
The most critical parameter which affects the reaction times of the PLL
is the reference frequency, f
RDV
. This frequency is the input to the phase
detector and controls how often the PLL makes corrections. For stability,
the corrections must be small compared to the desired frequency, so
several corrections are required to reduce the frequency error.
Therefore, the slower the reference the longer it takes to make these
corrections. This parameter is also under user control via the choice of
crystal frequency f
XCLK
.
Another critical parameter is the external filter capacitor. The PLL
modifies the voltage on the VCO by adding or subtracting charge from
this capacitor. Therefore, the rate at which the voltage changes for a
given frequency error (thus change in charge) is proportional to the
capacitor size. The size of the capacitor also is related to the stability of
the PLL. If the capacitor is too small, the PLL cannot make small enough
adjustments to the voltage and the system cannot lock. If the capacitor
is too large, the PLL may not be able to adjust the voltage in a
reasonable time. See 9.10.3 Choosing a Filter Capacitor.
