Datasheet

Mechanical Specifications
Technical Data MC68HC908GR8 — Rev 4.0
388 Mechanical Specifications MOTOROLA
24.3 32-Pin LQFP (Case #873A)
A
- U -
V
- Z -
S
B
- T -
DETAIL Y
Section AE–AE
G
-AC-
DETAIL AD
Seating
plane
8x M °
R
Q °
K
W
X
0.20 (0.008)
M
AC T – U Z
A1
S1
1
8
9
17
25
32
9
V1
B1
0.20 (0.008) AC T-U Z
4X
0.20 (0.008) AB T-U Z
4X
-AB-
0.10 (0.004) AC
C
E
H
0.25 (0.010)
Gauge Plane
DETAIL AD
F
N
D
J
Base Metal
AE
AE
DETAIL Y
–
T
–
,
–
U
–
,
–
Z
–
P
NOTES:
1. DIMENSIONS AND TOLERANCING AS PER ANSI
Y14.5M, 1982
2. CONTROLLING DIMENSION: MILLIMETER
3. DATUM PLANE -AB- IS LOCATED AT BOTTOM OF
LEAD AND IS CONSISTENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE
4. DATUMS -T-, -U-, AND -Z- TO BE DETERMINED AT
DATUM PLANE -AB-
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE -AC-
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -AB-
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020)
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003)
9. EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION
DIM
MILLIMETERS INCHES
MIN MAX MIN MAX
A 7.000 BSC 0.276 BSC
A1 3.500 BSC 0.138 BSC
B 7.000 BSC 0.276 BSC
B1 3.500 BSC 0.138 BSC
C 1.400 1.600 0.055 0.063
D 0.300 0.450 0.012 0.018
E 1.350 1.450 0.053 0.057
F 0.300 0.400 0.012 0.016
G 0.800 BSC 0.031 BSC
H 0.050 0.150 0.002 0.006
J 0.090 0.200 0.004 0.008
K 0.500 0.700 0.020 0.028
M 12° REF 12° REF
N 0.090 0.160 0.004 0.006
P 0.400 BSC 0.016 BSC
Q 1° 5° 1° 5°
R 0.150 0.250 0.006 0.010
S 9.000 BSC 0.354 BSC
S1 4.500 BSC 0.177 BSC
V 9.000 BSC 0.354 BSC
V1 4.500 BSC 0.177 BSC
W 0.200 REF 0.008 REF
X 1.000 REF 0.039 REF
Frees
cale Semiconductor,
I
Freescale Semiconductor, Inc.
For More Information On This Product,
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