Datasheet

Electrical Specifications
Technical Data MC68HC908GR8 Rev 4.0
380 Electrical Specifications MOTOROLA
23.14 3.0 V SPI Characteristics
Diagram
Number
(1)
1. Numbers refer to dimensions in Figure 23-16 and Figure 23-17.
Characteristic
(2)
2. All timing is shown with respect to 20% V
DD
and 70% V
DD
, unless noted; 100 pF load on all SPI pins.
Symbol Min Max Unit
Operating frequency
Master
Slave
f
OP(M)
f
OP(S)
f
OP
/128
DC
f
OP
/2
f
OP
MHz
MHz
1
Cycle time
Master
Slave
t
CYC(M)
t
CYC(S)
2
1
128
t
cyc
t
cyc
2 Enable lead time
t
Lead(s)
1
t
cyc
3 Enable lag time
t
Lag(s)
1
t
cyc
4
Clock (SPSCK) high time
Master
Slave
t
SCKH(M)
t
SCKH(S)
t
cyc
35
1/2 t
cyc
35
64 t
cyc
ns
ns
5
Clock (SPSCK) low time
Master
Slave
t
SCKL(M)
t
SCKL(S)
t
cyc
35
1/2 t
cyc
35
±
64 t
cyc
ns
ns
6
Data setup time (inputs)
Master
Slave
t
SU(M)
t
SU(S)
40
40
ns
ns
7
Data hold time (inputs)
Master
Slave
t
H(M)
t
H(S)
40
40
ns
ns
8
Access time, slave
(3)
CPHA = 0
CPHA = 1
3. Time to data active from high-impedance state
t
A(CP0)
t
A(CP1)
0
0
50
50
ns
ns
9
Disable time, slave
(4)
4. Hold time to high-impedance state
t
DIS(S)
50 ns
10
Data valid time, after enable edge
Master
Slave
(5)
5. With 100 pF on all SPI pins
t
V(M)
t
V(S)
60
60
ns
ns
11
Data hold time, outputs, after enable edge
Master
Slave
t
HO(M)
t
HO(S)
0
0
ns
ns
Notes:
Frees
cale Semiconductor,
I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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