Datasheet

MC68HC11D3 and MC68HC11D0
MC68HC711D3 Data Sheet, Rev. 2.1
128 Freescale Semiconductor
A.4 Memory Map
Figure A-4. MC68HC11Dx
(1)
Memory Map
A.5 MC68HC11D3 and MC68HC11D0 Electrical Characteristics
The parameters given in Chapter 9 Electrical Characteristics apply to the MC68HC11D3 and
MC68HC11D0 with the exceptions given here.
A.5.1 Functional Operating Temperature Range
A.5.2 Thermal Characteristics
1. MC68HC11D0 only operates in expanded multiplexed mode and bootstrap mode.
Rating Symbol Value Unit
Operating temperature range
MC68HC11D0C
T
A
T
L
to T
H
–40 to +85
°C
Characteristic Symbol Value Unit
Package thermal resistance (junction-to-ambient)
44-pin plastic leaded chip carrier (PLCC)
44-pin plastic quad flat pack (QFP
Θ
JA
50
85
°C/W
SINGLE
CHIP
SPECIAL SPECIAL
TEST
EXPANDED
192 BYTES STATIC RAM
INTERNAL REGISTERS AND I/O
SPECIAL MODES
INTERRUPT
VECTORS
4 KBYTES ROM (MC68HC11D3)
BOOT
ROM
$BFC0
$BFFF
$BF00
$BFFF
$7000
$7FFF
$0040
$00FF
$0000
$003F
$0000
$7000
$8000
$B000
$FFFF
MULTIPLEXED BOOTSTRAP
EXTERNAL
EXTERNAL
(CAN BE MAPPED TO ANY 4-K BOUNDARY
USING INIT REGISTER)
(CAN BE MAPPED TO ANY 4-K BOUNDARY
USING THE INIT REGISTER)
PRESENT AT RESET AND CAN BE DISABLED BY
ROM ON BIT IN CONFIG REGISTER.
INTERRUPT VECTORS ARE EXTERNAL.
NORMAL MODES
INTERRUPT
VECTORS
4-KBYTES
ROM
$FFC0
$FFFF
$FF00
$FFFF