Datasheet

MC68HC711D3 Data Sheet, Rev. 2.1
Freescale Semiconductor 121
Chapter 10
Ordering Information and Mechanical Specifications
10.1 Introduction
This section provides ordering information for the MC68HC711D3. In addition, mechanical specifications
are provided for the following packaging options:
• 40-pin plastic dual in-line package (DIP)
• 44-pin plastic leaded chip carrier (PLCC)
• 44-pin plastic quad flat pack (QFP)
10.2 Ordering Information
10.3 40-Pin DIP (Case 711-03)
Table 10-1. MC Order Numbers
Package Type Temperature
MC Order Number
2 MHz 3 MHz
40-pin DIP –40 to +85°C MC68HC711D3CP2 MC68HC711D3CP3
44-pin PLCC
–40 to +85°C MC68HC711D3CFN2 MC68HC711D3CFN3
–40 to +105°C MC68HC711D3VFN2 MC68HC711D3VFN3
44-pin QFP –40 to +85°C MC68HC711D3CFB2 MC68HC711D3CFB3
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
120
40 21
B
A
C
SEATING
PLANE
DFGH
K
N
M
J
L
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 51.69 52.45 2.035 2.065
B 13.72 14.22 0.540 0.560
C 3.94 5.08 0.155 0.200
D 0.36 0.56 0.014 0.022
F 1.02 1.52 0.040 0.060
G 2.54 BSC 0.100 BSC
H 1.65 2.16 0.065 0.085
J 0.20 0.38 0.008 0.015
K 2.92 3.43 0.115 0.135
L 15.24 BSC 0.600 BSC
M 0 15 0 15
N 0.51 1.02 0.020 0.040
°° °°