Datasheet

Specifications
MC56F825x/MC56F824x Digital Signal Controller, Rev. 3
Freescale Semiconductor 51
NOTE
Junction-to-ambient thermal resistance determined per JEDEC JESD51–3 and JESD51–6.
Thermal test board meets JEDEC specification for this package.
Junction-to-board thermal resistance determined per JEDEC JESD51–8. Thermal test
board meets JEDEC specification for the specified package.
Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1.
The cold plate temperature is used for the case temperature. Reported value includes the
thermal resistance of the interface layer.
Thermal characterization parameter indicating the temperature difference between the
package top and the junction temperature per JEDEC JESD51–2. When Greek letters are
not available, the thermal characterization parameter is written as Psi-JT.
Table 20. 48LQFP Package Thermal Characteristics
Characteristic Comments Symbol
Value
(LQFP)
Unit
Junction to ambient
Natural convection
Single layer board
(1s)
R
θJA
67 °C/W
Junction to ambient
Natural convection
Four layer board
(2s2p)
R
θJMA
48 °C/W
Junction to ambient
(@200 ft/min)
Single layer board
(1s)
R
θJMA
60 °C/W
Junction to ambient
(@200 ft/min)
Four layer board
(2s2p)
R
θJMA
44 °C/W
Junction to board R
θJB
24 °C/W
Junction to case R
θJC
15 °C/W
Junction to package top Natural Convection Ψ
JT
2°C/W
Table 21. 64LQFP Package Thermal Characteristics
Characteristic Comments Symbol
Value
(LQFP)
Unit
Junction to ambient
Natural convection
Single layer board
(1s)
R
θJA
67 °C/W
Junction to ambient
Natural convection
Four layer board
(2s2p)
R
θJMA
48 °C/W
Junction to ambient
(@200 ft/min)
Single layer board
(1s)
R
θJMA
55 °C/W
Junction to ambient
(@200 ft/min)
Four layer board
(2s2p)
R
θJMA
42 °C/W
Junction to board R
θJB
31 °C/W
Junction to case R
θJC
14 °C/W
Junction to package top Natural convection Ψ
JT
3°C/W