Datasheet

56F8033/56F8023 Data Sheet, Rev. 6
124 Freescale Semiconductor
10.4 Flash Memory Characteristics
10.5 External Clock Operation Timing
Figure 10-4 External Clock Timing
Table 10-9 Flash Timing Parameters
Characteristic Symbol Min Typ Max Unit
Program time
1
1. There is additional overhead which is part of the programming sequence. See the 56F802X and 56F803X Peripheral
Reference Manual for details.
Tprog
20 — 40 μs
Erase time
2
2. Specifies page erase time. There are 512 bytes per page in the Program Flash memory.
Terase
20 — — ms
Mass erase time
Tme
100 — — ms
Table 10-10 External Clock Operation Timing Requirements
1
1. Parameters listed are guaranteed by design.
Characteristic Symbol Min Typ Max Unit
Frequency of operation (external clock driver)
2
2. See Figure 10-4 for details on using the recommended connection of an external clock driver.
f
osc
488MHz
Clock Pulse Width
3
3. The chip may not function if the high or low pulse width is smaller than 6.25ns.
t
PW
6.25 — — ns
External Clock Input Rise Time
4
4. External clock input rise time is measured from 10% to 90%.
t
rise
—— 3ns
External Clock Input Fall Time
5
5. External clock input fall time is measured from 90% to 10%.
t
fall
—— 3ns
External
Clock
V
IH
V
IL
Note: The midpoint is V
IL
+ (V
IH
– V
IL
)/2.
90%
50%
10%
90%
50%
10%
t
PW
t
PW
t
fall t
rise