Datasheet

General Characteristics
56F8033/56F8023 Data Sheet, Rev. 6
Freescale Semiconductor 119
Default Mode
Pin Group 1: GPIO, TDI, TDO, TMS, TCK
Pin Group 2: RESET, GPIOA7
Pin Group 3: ADC and Comparator Analog Inputs
Pin Group 4 XTAL, EXTAL
Table 10-4 Recommended Operating Conditions
(V
REFL x
= 0V, V
SSA
= 0V, V
SS
= 0V)
Characteristic Symbol Notes Min Typ Max Unit
Supply voltage
V
DD,
V
DDA
33.33.6 V
ADC Reference Voltage High
V
REFHx
3.0 V
DDA
V
Voltage difference V
DD
to V
DDA
ΔV
DD
-0.1 0 0.1 V
Voltage difference V
SS
to V
SSA
ΔV
SS
-0.1 0 0.1 V
Device Clock Frequency
Using relaxation oscillator
Using external clock source
FSYSCLK
1
0
32
32
MHz
Input Voltage High (digital inputs)
V
IH
Pin Groups 1, 2 2.0 5.5 V
Input Voltage Low (digital inputs)
V
IL
Pin Groups 1, 2 -0.3 0.8 V
Oscillator Input Voltage High
XTAL driven by an external clock source
V
IHOSC
Pin Group 4 2.0 V
DDA
+ 0.3 V
Oscillator Input Voltage Low
V
ILOSC
Pin Group 4 -0.3 0.8 V
Output Source Current High at V
OH
min.)
1
When programmed for low drive strength
When programmed for high drive strength
1. Total chip source or sink current cannot exceed 75mA
I
OH
Pin Group 1
Pin Group 1
—
—
-4
-8
mA
Output Source Current Low (at V
OL
max.)
1
When programmed for low drive strength
When programmed for high drive strength
I
OL
Pin Groups 1, 2
Pin Groups 1, 2
—
—
4
8
mA
Ambient Operating Temperature
(Extended Industrial)
T
A
-40 105 °C
Flash Endurance
(Program Erase Cycles)
N
F
T
A
= -40°C to
125°C
10,000 — cycles
Flash Data Retention
T
R
T
J
<= 85°C avg 15 — years
Flash Data Retention with <100
Program/Erase Cycles
t
FLRET
T
J
<= 85°C avg 20 — — years