Datasheet
Analog Integrated Circuit Device Data
Freescale Semiconductor 5
33660
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating Symbol Value Unit
VDD DC Supply Voltage
V
DD
-0.3 to 7.0 V
VBB Load Dump Peak Voltage (in accordance with ISO 7637-2 & ISO
7637-3)
Pulse 5a - 33660B only
Pulse 5b
V
BB(5a)
V
BB(5b)
82
45
V
ISO Pin Load Dump Peak Voltage
(3)
V
ISO
40 V
ESD Voltage
(4)
Human Body Model
(5)
Machine Model
(5)
33660
33660B
Charge Device Model
(5)
Corner Pins
All other Pins
Module Level ESD (Air Discharge, Powered)
(6)
33660B only
ISO pin with 33 V zener diode and 470 pF capacitor to GND -
V
ESD1
V
ESD2
V
ESD3-1
V
ESD3-2
V
ESD4
±2000
±150
±200
±750
±500
±25000
V
ISO Clamp Energy
(7)
E
CLAMP
10 mJ
Storage Temperature
T
STG
-55 to +150 C
Operating Case Temperature
T
C
-40 to +125 C
Operating Junction Temperature
T
J
-40 to +150 C
Power Dissipation T
A
= 25 C
P
D
100 mW
Peak Package Reflow Temperature During Reflow
(8)
,
(9)
T
PPRT
Note 9.
°C
Thermal Resistance: Junction-to-Ambient
R
JA
150 C/W
Notes
3. Device will survive double battery jump start conditions in typical applications for 10 minutes duration, but is not guaranteed to remain
within specified parametric limits during this duration.
4. ESD data available upon request.
5. ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500 ), ESD2 testing is performed in
accordance with the Machine Model (C
ZAP
= 200 pF, R
ZAP
= 0 ), ESD3 testing is performed in accordance with the Charge Device
Model (C
ZAP
= 4.0 pF).
6. ESD4 testing is performed in accordance with ISO 10605 ESD model (C = 330 pF, R = 2.0 k). ESD discharges start at ±5.0 kV and
go up to ±25
kV in increments of 5.0 kV. There are two positions for discharges: 8.0 cm cable from ISO connector, 85 cm cable from
ISO connector. There are 10 ESD discharges per voltage at each cable position at a minimum of 1.0
s intervals. Remaining charge is
not bled off after every discharge.
7. Nonrepetitive clamping capability at 25 C.
8. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
9. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.