Datasheet

LPC82x All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 1 October 2014 74 of 81
NXP Semiconductors
LPC82x
32-bit ARM Cortex-M0+ microcontroller
16. Soldering
Fig 45. Reflow soldering of the TSSOP20 package
DIMENSIONS in mm
Ay By D1 D2 Gy HyP1 C Gx
sot360-1_fr
Hx
SOT360-1
solder land
occupied area
Footprint information for reflow soldering of TSSOP20 package
AyByGy
C
Hy
Hx
Gx
P1
Generic footprint pattern
Refer to the package outline drawing for actual layout
P2
(0.125) (0.125)
D1
D2 (4x)
P2
7.200 4.500 1.350 0.400 0.600 6.900 5.300 7.4507.3000.650 0.750