Datasheet

LPC82x All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 1 October 2014 32 of 81
NXP Semiconductors
LPC82x
32-bit ARM Cortex-M0+ microcontroller
[11] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
10. Thermal characteristics
The average chip junction temperature, T
j
(C), can be calculated using the following
equation:
(1)
• T
amb
= ambient temperature (C),
• R
th(j-a)
= the package junction-to-ambient thermal resistance (C/W)
• P
D
= sum of internal and I/O power dissipation
The internal power dissipation is the product of I
DD
and V
DD
. The I/O power dissipation of
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
Table 6. Thermal resistance
Symbol Parameter Conditions Max/min Unit
HVQFN33 package
R
th(j-a)
thermal resistance from
junction-to-ambient
JEDEC (4.5 in  4 in); still air 40 +/- 15 % C/W
single-layer (4.5 in  3 in); still
air
114 +/- 15 % C/W
R
th(j-c)
thermal resistance from
junction-to-case
18 +/- 15 % C/W
T
j
T
amb
P
D
R
th j a–
+=