Datasheet

LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 106 of 155
NXP Semiconductors
LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
11. Dynamic characteristics
11.1 Wake-up times
[1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply
voltages.
[2] T
cy(clk)
= 1/CCLK with CCLK = CPU clock frequency.
11.2 External clock for oscillator in slave mode
Remark: The input voltage on the XTAL1/2 pins must be  1.2 V (see Table 10). For
connecting the oscillator to the XTAL pins, also see Section 13.2
and Section 13.4.
[1] Parameters are valid over operating temperature range unless otherwise specified.
Table 13. Dynamic characteristic: Wake-up from Deep-sleep, Power-down, and Deep
power-down modes
T
amb
=  40  C to +85  C
Symbol Parameter Conditions Min Typ
[1]
Max Unit
t
wake
wake-up time from Sleep mode
[2]
3 
T
cy(clk)
5  T
cy(clk)
-ns
from Deep-sleep and
Power-down mode
12 51 - s
from Deep power-down mode - 250 - s
after reset - 250 - s
Table 14. Dynamic characteristic: external clock
T
amb
=  40  C to +85  C; V
DD(IO)
over specified ranges.
[1]
Symbol Parameter Conditions Min Max Unit
f
osc
oscillator frequency 1 25 MHz
T
cy(clk)
clock cycle time 40 1000 ns
t
CHCX
clock HIGH time T
cy(clk)
 0.4 T
cy(clk)
 0.6 ns
t
CLCX
clock LOW time T
cy(clk)
 0.4 T
cy(clk)
 0.6 ns
Fig 26. External clock timing (with an amplitude of at least V
i(RMS)
= 200 mV)
t
CLCX
t
CHCX
T
cy(clk)
002aag698