Datasheet

LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3.1 — 1 September 2014 127 of 138
NXP Semiconductors
LPC408x/7x
32-bit ARM Cortex-M4 microcontroller
Fig 53. Reflow soldering of the TFBGA180 package
DIMENSIONS in mm
PSLSPSRHxHy
Hx
Hy
SOT570-3
solder land plus solder paste
occupied area
Footprint information for reflow soldering of TFBGA180 package
solder land
solder paste deposit
solder resist
P
P
SL
SP
SR
Generic footprint pattern
Refer to the package outline drawing for actual layout
detail X
see detail X
sot570-3_fr
0.80 0.400 0.400 0.550 12.575 12.575