Datasheet

LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3.1 — 1 September 2014 126 of 138
NXP Semiconductors
LPC408x/7x
32-bit ARM Cortex-M4 microcontroller
15. Soldering
Fig 52. Reflow soldering of the LQFP208 package
SOT459-1
DIMENSIONS in mm
occupied area
Footprint information for reflow soldering of LQFP208 package
Ax
Bx
Gx
Gy
Hy
Hx
AyBy
P1P2
D2 (8×) D1
(0.125)
Ax Ay Bx By D1 D2 Gx Gy Hx HyP1 P2 C
sot459-1_fr
solder land
C
Generic footprint pattern
Refer to the package outline drawing for actual layout
31.300 31.300 28.300 28.3000.500 0.560 0.2801.500 0.400 28.500 28.500 31.550 31.550