Datasheet

LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 7.1 — 16 October 2013 64 of 69
NXP Semiconductors
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
17. Revision history
Table 20. Revision history
Document ID Release date Data sheet status Change
notice
Supersedes
LPC2364_65_66_67_68 v.7.1 20131016 Product data sheet - LPC2364_65_66_67_68 v.7
Modifications:
• Table 4 “Pin description”, Table note 6: Changed glitch filter spec from 5 ns to 10 ns.
• Table 9 “Dynamic characteristics”: Changed min clock cycle time from 42 to 40.
LPC2364_65_66_67_68 v.7 20111020 Product data sheet - LPC2364_65_66_67_68 v.6
Modifications:
• Table 13 “Dynamic characteristics of flash”: Added characteristics for t
er
and t
prog
.
• Table 4 “Pin description”: Updated description for USB_UP_LED.
• Table 4 “Pin description”: Added Table note 12 “If the RTC is not used, these pins can
be left floating.” for RTCX1 and RTCX2 pins.
• Table 4 “Pin description”: Added Table note 8 “This pin has a built-in pull-up resistor.”
for DBGEN, TMS, TDI, TRST, and RTCK pins.
• Table 4 “Pin description”: Added Table note 7 “This pin has no built-in pull-up and no
built-in pull-down resistor.” for TCK and TDO pins.
• Table 5 “Limiting values”: Added “non-operating” to conditions column of T
stg
.
• Table 5 “Limiting values”: Updated Table note 5 “The maximum non-operating
storage temperature is different than the temperature for required shelf life which
should be determined based on required shelf lifetime. Please refer to the JEDEC
spec (J-STD-033B.1) for further details.”.
• Table 5 “Limiting values”: Updated storage temperature min/max to 65/+150.
• Added Table 7 “Thermal resistance value (C/W): ±15 %”.
• Added Table 10 “Dynamic characteristic: internal oscillators”.
• Added Table 11 “Dynamic characteristic: I/O pins[1]”.
• Table 8 “Static characteristics”: Changed V
hys
typ value from 0.5V
DD(3V3)
to
0.05V
DD(3V3)
.
• Table 13 “Dynamic characteristics of flash”: Updated table.
• Added Section 9 “Thermal characteristics”.
• Added Section 10.3 “Electrical pin characteristics”.
• Added Section 14.2 “Crystal oscillator XTAL input and component selection”.
• Added Section 14.3 “RTC 32 kHz oscillator component selection”.
• Added Section 14.4 “XTAL and RTCX Printed Circuit Board (PCB) layout guidelines”.
• Added Section 14.5 “Standard I/O pin configuration”.
• Added Section 14.6 “Reset pin configuration”.