Datasheet
Table Of Contents
- 1. General description
- 2. Features and benefits
- 3. Applications
- 4. Ordering information
- 5. Block diagram
- 6. Pinning information
- 7. Functional description- 7.1 Architectural overview
- 7.2 On-chip flash programming memory
- 7.3 On-chip SRAM
- 7.4 Memory map
- 7.5 Interrupt controller
- 7.6 Pin connect block
- 7.7 General purpose DMA controller
- 7.8 Fast general purpose parallel I/O
- 7.9 Ethernet (LPC2362 only)
- 7.10 USB interface
- 7.11 CAN controller and acceptance filters
- 7.12 10-bit ADC
- 7.13 10-bit DAC
- 7.14 UARTs
- 7.15 SPI serial I/O controller
- 7.16 SSP serial I/O controller
- 7.17 I2C-bus serial I/O controllers
- 7.18 I2S-bus serial I/O controllers
- 7.19 General purpose 32-bit timers/external event counters
- 7.20 Pulse width modulator
- 7.21 Watchdog timer
- 7.22 RTC and battery RAM
- 7.23 Clocking and power control
- 7.24 System control
- 7.25 Emulation and debugging
 
- 8. Limiting values
- 9. Thermal characteristics
- 10. Static characteristics
- 11. Dynamic characteristics
- 12. ADC electrical characteristics
- 13. DAC electrical characteristics
- 14. Application information
- 15. Package outline
- 16. Abbreviations
- 17. Revision history
- 18. Legal information
- 19. Contact information
- 20. Contents

LPC2361_62 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5.1 — 15 October 2013  63 of 65
NXP Semiconductors
LPC2361/62
Single-chip 16-bit/32-bit MCU
Export control — This document as well as the item(s) described herein 
may be subject to export control regulations. Export might require a prior 
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly 
states that this specific NXP Semiconductors product is automotive qualified, 
the product is not suitable for automotive use. It is neither qualified nor tested 
in accordance with automotive testing or application requirements. NXP 
Semiconductors accepts no liability for inclusion and/or use of 
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in 
automotive applications to automotive specifications and standards, customer 
(a) shall use the product without NXP Semiconductors’ warranty of the 
product for such automotive applications, use and specifications, and (b) 
whenever customer uses the product for automotive applications beyond 
NXP Semiconductors’ specifications such use shall be solely at customer’s 
own risk, and (c) customer fully indemnifies NXP Semiconductors for any 
liability, damages or failed product claims resulting from customer design and 
use of the product for automotive applications beyond NXP Semiconductors’ 
standard warranty and NXP Semiconductors’ product specifications.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks 
are the property of their respective owners.
I
2
C-bus — logo is a trademark of NXP B.V.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com










