Datasheet

LPC2109_2119_2129 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 7 — 14 June 2011 41 of 46
NXP Semiconductors
LPC2109/2119/2129
Single-chip 16/32-bit microcontrollers
10. Package outline
Fig 19. Package outline SOT314-2 (LQFP64)
UNIT
A
max.
A
1
A
2
A
3
b
p
cE
(1)
eH
E
LL
p
Zywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
1.6
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
10.1
9.9
0.5
12.15
11.85
1.45
1.05
7
0
o
o
0.12 0.11 0.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT314-2 MS-026136E10
00-01-19
03-02-25
D
(1) (1)(1)
10.1
9.9
H
D
12.15
11.85
E
Z
1.45
1.05
D
b
p
e
θ
E
A
1
A
L
p
detail X
L
(A )
3
B
16
c
D
H
b
p
E
H
A
2
v M
B
D
Z
D
A
Z
E
e
v M
A
X
1
64
49
48 33
32
17
y
pin 1 index
w M
w M
0 2.5 5 mm
scale
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
SOT314-2