Datasheet

LPC2101_02_03_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 2 June 2009 35 of 37
NXP Semiconductors
LPC2101/02/03
Single-chip 16-bit/32-bit microcontrollers
13. Revision history
Table 9. Revision history
Document ID Release date Data sheet status Change
notice
Supersedes
LPC2101_02_03_4 20090602 Product data sheet LPC2101_02_03_3
Modifications:
• Section 6.17.4 “Code security (Code Read Protection - CRP)”: added description of three
CRP levels (applicable to Revision A and higher).
• Section 6.17.7 “Power control”: added description of Deep power-down mode (applicable to
Revision A and higher).
• Section 10.1 “XTAL1 input” added.
• Section 10.2 “XTAL and RTC Printed Circuit Board (PCB) layout guidelines” added.
• Figure 6, Figure 7, Figure 8: added power consumption data for Deep power-down mode
(applicable to Revision A and higher).
• Table 3: added table note 7.
• Table 3: modified description of P0.14, RTCX1, RTCX2, XTAL1, XTAL2, JTAG, and DBGSEL
pins.
• Table 4: modified value for V
DD(3V3)
.
• Table 5: added and modified values for V
hys
.
• Table 5: Voltage range for pins V
DD(3V3)
and V
DDA
extended to 2.6 V.
LPC2101_02_03_3 20081007 Product data sheet - LPC2101_02_03_2
Modifications:
• Updated data sheet status to Product data sheet.
• Table 1 and Table 2: added LPC2102FHN48 and LPC2103FHN48.
• Table 1, Table 2, Table 3 and related figures: removed LPC2103FA44.
• Table 3: updated pad descriptions.
• Table 3: updated description of pin 47, SCL1.
• Table 3: updated description of pins V
DDA
and V
DD(1V8)
.
• Table 4: changed storage temperature range from −40 °C/125 °C to −65 °C/150 °C.
• Table 5: added or modified values for I
DD(act)
, I
DD(pd)
, I
BATpd
, I
BATact
.
• Table 5: removed “CCLK = 10 MHz” and associated values for I
DD(act)
.
• Section 5: added Figure 3.
• Section 11: added Figure 11.
LPC2101_02_03_2 20071218 Preliminary data sheet - LPC2101_02_03_1
LPC2101_02_03_1 20060118 Preliminary data sheet - -