Datasheet

LPC2101_02_03_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 2 June 2009 33 of 37
NXP Semiconductors
LPC2101/02/03
Single-chip 16-bit/32-bit microcontrollers
Fig 12. Package outline SOT778-3 (HVQFN48)
terminal 1
index area
terminal 1
index area
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT778-3 - - -
- - -
- - -
SOT778-3
04-06-16
04-06-23
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included
DIMENSIONS (mm are the original dimensions)
HVQFN48: plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 6 x 6 x 0.85 mm
detail X
E
h
D
h
L
A
c
A
1
b
D
E
B
C
A
12
13 24
48 37
1
25
36
e
2
e
1
e
e
1/2 e
1/2 e
AC
B
v
M
Cw
M
y
C
y
1
X
0 2.5 5 mm
scale
UNIT
mm
0.05
0.00
0.25
0.15
6.1
5.9
6.1
5.9
3.95
3.65
0.5
0.3
A
1
b
1
A
(1)
max
D
(1)
E
(1)
E
h
3.95
3.65
D
h
ee
1
L v
0.14.4
e
2
4.40.4
c
0.2
w
0.05
y
0.05
y
1
0.1