Datasheet

LPC2101_02_03_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 2 June 2009 32 of 37
NXP Semiconductors
LPC2101/02/03
Single-chip 16-bit/32-bit microcontrollers
Fig 11. Package outline SOT619-7 (HVQFN48)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT619-7 - - -
MO-220
- - -
SOT619-7
05-10-24
05-10-25
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included
HVQFN48: plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 7 x 7 x 0.85 mm
0 2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
0.05
0.00
0.30
0.18
7.1
6.9
7.1
6.9
3.45
3.15
0.5
0.3
A
1
b
1
A
(1)
max
D
(1)
E
(1)
E
h
3.45
3.15
D
h
ee
1
L v
0.15.5
e
2
5.50.5
c
0.2
w
0.05
y
0.05
y
1
0.1
C
y
C
y
1
X
A
detail X
A
1
c
b
terminal 1
index area
D
h
E
h
L
e
2
e
1
e
e
1/2 e
1/2 e
AC
B
v
M
Cw
M
13 24
48 37
36
25
12
1
terminal 1
index area
D
E
B
A