Datasheet

LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 5 — 9 September 2014 112 of 122
NXP Semiconductors
LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
Fig 46. Reflow soldering of the TFBGA180 package
DIMENSIONS in mm
PSLSPSRHxHy
Hx
Hy
SOT570-3
solder land plus solder paste
occupied area
Footprint information for reflow soldering of TFBGA180 package
solder land
solder paste deposit
solder resist
P
P
SL
SP
SR
Generic footprint pattern
Refer to the package outline drawing for actual layout
detail X
see detail X
sot570-3_fr
0.80 0.400 0.400 0.550 12.575 12.575