Datasheet

NXP Semiconductors
LPC1769/68/67/66/65/64/63
32-bit ARM Cortex-M3 microcontroller
© NXP Semiconductors N.V. 2014. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Date of release: 24 June 2014
Document identifier: LPC1769_68_67_66_65_64_63
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
11 Static characteristics. . . . . . . . . . . . . . . . . . . . 47
11.1 Power consumption . . . . . . . . . . . . . . . . . . . . 50
11.2 Peripheral power consumption. . . . . . . . . . . . 53
11.3 Electrical pin characteristics . . . . . . . . . . . . . . 54
12 Dynamic characteristics . . . . . . . . . . . . . . . . . 56
12.1 Flash memory. . . . . . . . . . . . . . . . . . . . . . . . . 56
12.2 External clock . . . . . . . . . . . . . . . . . . . . . . . . . 56
12.3 Internal oscillators. . . . . . . . . . . . . . . . . . . . . . 57
12.4 I/O pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
12.5 I
2
C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
12.6 I
2
S-bus interface . . . . . . . . . . . . . . . . . . . . . . 59
12.7 SSP interface . . . . . . . . . . . . . . . . . . . . . . . . . 61
12.8 USB interface . . . . . . . . . . . . . . . . . . . . . . . . 63
12.9 SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
13 ADC electrical characteristics . . . . . . . . . . . . 66
14 DAC electrical characteristics . . . . . . . . . . . . 69
15 Application information. . . . . . . . . . . . . . . . . . 70
15.1 Suggested USB interface solutions . . . . . . . . 70
15.2 Crystal oscillator XTAL input and component
selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
15.3 XTAL and RTCX Printed Circuit Board (PCB)
layout guidelines. . . . . . . . . . . . . . . . . . . . . . . 74
15.4 Standard I/O pin configuration . . . . . . . . . . . . 75
15.5 Reset pin configuration. . . . . . . . . . . . . . . . . . 76
15.6 ElectroMagnetic Compatibility (EMC). . . . . . . 77
16 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 78
17 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
18 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 83
19 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
20 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 84
21 Legal information. . . . . . . . . . . . . . . . . . . . . . . 86
21.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 86
21.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
21.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
21.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 87
22 Contact information. . . . . . . . . . . . . . . . . . . . . 87
23 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88