Datasheet

DRAFT DRAFT DRAFT DR DRAFT DRAFT DRAFT
D
RAF
DRAFT DRAFT DRA
F
T D
RAFT DR
AFT D
DRA
F
T DRAFT DRAFT
D
RAFT
DRAFT
D
RAFT
DRA
LPC15xx All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved.
Objective data sheet Rev. 1.0 — 16 January 2014 92 of 98
NXP Semiconductors
LPC15xx
32-bit ARM Cortex-M3 microcontroller
Fig 51. Reflow soldering for the LQFP64 package
SOT314-2
DIMENSIONS in mm
occupied area
Footprint information for reflow soldering of LQFP64 package
Ax
Bx
Gx
Gy
Hy
Hx
AyBy
P1P2
D2 (8×) D1
(0.125)
Ax Ay Bx By D1 D2 Gx Gy Hx Hy
13.300 13.300 10.300 10.300
P1
0.500
P2
0.560 0.280
C
1.500 0.400 10.500 10.500 13.550 13.550
sot314-2_fr
solder land
C
Generic footprint pattern
Refer to the package outline drawing for actual layout