Datasheet

DRAFT DRAFT DRAFT DR DRAFT DRAFT DRAFT
D
RAF
DRAFT DRAFT DRA
F
T D
RAFT DR
AFT D
DRA
F
T DRAFT DRAFT
D
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DRAFT
D
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DRA
LPC15xx All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved.
Objective data sheet Rev. 1.0 — 16 January 2014 51 of 98
NXP Semiconductors
LPC15xx
32-bit ARM Cortex-M3 microcontroller
Table 9. Thermal resistance value (C/W): ±15 %
Symbol Parameter Conditions Typ Unit
LQFP48
ja thermal resistance
junction-to-ambient
JEDEC (4.5 in  4 in)
0 m/s 64 C/W
1 m/s 55 C/W
2.5 m/s 50 C/W
8-layer (4.5 in  3 in)
0 m/s 96 C/W
1 m/s 76 C/W
2.5 m/s 67 C/W
jc thermal resistance
junction-to-case
13 C/W
jb thermal resistance
junction-to-board
16 C/W
LQFP64
ja thermal resistance
junction-to-ambient
JEDEC (4.5 in  4 in)
0 m/s 51 C/W
1 m/s 45 C/W
2.5 m/s 41 C/W
8-layer (4.5 in  3 in)
0 m/s 75 C/W
1 m/s 60 C/W
2.5 m/s 54 C/W
jc thermal resistance
junction-to-case
13 C/W
jb thermal resistance
junction-to-board
17 C/W
LQFP100
ja thermal resistance
junction-to-ambient
JEDEC (4.5 in  4 in)
0 m/s 42 C/W
1 m/s 37 C/W
2.5 m/s 34 C/W
8-layer (4.5 in  3 in)
0 m/s 59 
C/W
1 m/s 48 C/W
2.5 m/s 44 C/W
jc thermal resistance
junction-to-case
12 C/W
jb thermal resistance
junction-to-board
17 C/W