Datasheet

LPC1315_16_17_45_46_47 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 3 — 20 September 2012 69 of 77
NXP Semiconductors
LPC1315/16/17/45/46/47
32-bit ARM Cortex-M3 microcontroller
14. Soldering
Fig 37. Reflow soldering of the HVQFN33 package
Footprint information for reflow soldering of HVQFN33 package
001aao134
occupied area
solder land
solder resist
solder land plus solder paste
solder paste deposit
Dimensions in mm
Remark:
Stencil thickness: 0.125 mm
e = 0.65
evia = 4.25
OwDtot = 5.10 OA
PID = 7.25 PA+OA
OID = 8.20 OA
0.20 SR
chamfer (4×)
0.45 DM
evia = 1.05
W = 0.30 CU
evia = 4.25
evia = 2.40
LbE = 5.80 CU
LbD = 5.80 CU
PIE = 7.25 PA+OA
LaE = 7.95 CU
LaD = 7.95 CU
OIE = 8.20 OA
OwEtot = 5.10 OA
EHS = 4.85 CU
DHS = 4.85 CU
4.55 SR
4.55 SR
B-side
(A-side fully covered)
number of vias: 20
Solder resist
covered via
0.30 PH
0.60 SR cover
0.60 CU
SEhtot = 2.70 SP
SDhtot = 2.70 SP
GapE = 0.70 SP
SPE = 1.00 SP
0.45 DM
SPD = 1.00 SP
GapD = 0.70 SP